Abstract: The present invention relates to a focus ring for improvement of a semiconductor plasma etching process, which is circular, penetrates vertically into the middle portion thereof, and has a plurality of slots equally spaced apart from one another by a given distance on the edge periphery of the underside thereof in a longitudinal direction thereof, wherein so as to allow a plasma to be dispersed and exhausted uniformly at a fast speed through the slots, each slot becomes increased or decreased in diameter in a direction from top to bottom thereof to thus have a top diameter and a bottom diameter different from each other, and otherwise, each slot is rounded inward from both of top and bottom peripheries thereof.