Abstract: The present invention provides a specific acrylate compound component for a pressure-sensitive adhesive composition where it has excellent wettability, light resistance, and heat resistance. Moreover, it provides the pressure-sensitive adhesive composition which can cover step differences and defects and can minimize air bubbles or liftings between laminated layers while satisfying fundamentally required physical properties such as durability and pressure-sensitive adhesive. Especially, it provides the pressure-sensitive adhesive composition capable of minimizing air bubbles or liftings between laminated layers while satisfying fundamentally required physical properties such as durability and pressure-sensitive adhesive even when left at high temperature for a long time. It also provides an optical pressure-sensitive adhesive product which can cover defects located between laminated layers for a display module or a transparent electrode product.

Abstract: A copper plasma etching method according an exemplary embodiment includes: placing a substrate on a susceptor in a process chamber of a plasma etching apparatus; supplying an etching gas that include hydrogen chloride into the process chamber; plasma-etching a conductor layer that include copper in the substrate; and maintaining a temperature of the susceptor at 10° C. or less during the plasma-etching.

Abstract: A copper plasma etching method according an exemplary embodiment includes: placing a substrate on a susceptor in a process chamber of a plasma etching apparatus; supplying an etching gas that include hydrogen chloride into the process chamber; plasma-etching a conductor layer that include copper in the substrate; and maintaining a temperature of the susceptor at 10° C. or less during the plasma-etching.