Patents by Inventor Seongbin OH

Seongbin OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D STACKABLE SYNAPSE STRING AND 3D STACKABLE SYNAPSE ARRAY USING THE STRING
    Publication number: 20260143699
    Abstract: Provided is a 3D stackable synapse string. The 3D stackable synapse string includes: a channel hole having a pillar shape extending in a vertical direction and filled with an insulating material; a first synapse string provided on a first surface of an outer peripheral surface of the channel hole, the first synapse string including a plurality of first synapse devices stacked along a vertical direction of the channel hole; a second synapse string provided on a second surface of the outer peripheral surface of the channel hole, the second synapse string including a plurality of second synapse devices stacked along the vertical direction of the channel hole; and a device isolation portion provided on the outer peripheral surface of the channel hole between the first and second synapse strings. The two synapse strings are electrically separated from each other by the device isolation portion.
    Type: Application
    Filed: January 8, 2026
    Publication date: May 21, 2026
    Inventors: Jong-Ho LEE, Young-tak SEO, Soochang LEE, Seongbin OH, Jangsaeng KIM
  • 3D synapse device stack, 3D stackable synapse array using the 3D synapse device stacks and method of fabricating the stack
    Patent number: 12495553
    Abstract: Provided is a 3D synapse device stack, a 3D stackable synapse array using the same, and a method for manufacturing the 3D synapse device stack.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: December 9, 2025
    Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Jong-Ho Lee, Young-tak Seo, Soochang Lee, Seongbin Oh, Jangsaeng Kim
  • 3D STACKABLE SYNAPSE STRING, 3D STACKABLE SYNAPSE ARRAY USING THE STRING AND METHOD OF FABRICATING THE STRING
    Publication number: 20230058502
    Abstract: Provided is a 3D stackable synapse string, a 3D stackable synapse array using the same, and a method for manufacturing the 3D stackable synapse string.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 23, 2023
    Inventors: Jong-Ho LEE, Young-tak SEO, Soochang LEE, Seongbin OH, Jangsaeng KIM
  • 3D CAPACITOR STACK AND METHOD OF FABRICATING THE STACK
    Publication number: 20230057424
    Abstract: Provided is a 3D capacitor stack and a method for manufacturing the same. The 3D capacitor stack comprises: a drain line electrode having a pillar shape provided in a vertical direction on a substrate surface; a plurality of first insulating layers positioned in first region of an outer circumferential surface of the drain line electrode; a plurality of drains positioned in second regions of an outer circumferential surface of the drain line electrode; a plurality of insulator stacks positioned on side surfaces of the drains; and a plurality of word lines positioned on side surfaces of the insulator stacks.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 23, 2023
    Inventors: Jong-Ho LEE, Young-tak SEO, Soochang LEE, Seongbin OH, Jangsaeng KIM
  • 3D SYNAPSE DEVICE STACK, 3D STACKABLE SYNAPSE ARRAY USING THE 3D SYNAPSE DEVICE STACKS AND METHOD OF FABRICATING THE STACK
    Publication number: 20230053693
    Abstract: Provided is a 3D synapse device stack, a 3D stackable synapse array using the same, and a method for manufacturing the 3D synapse device stack.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 23, 2023
    Inventors: Jong-Ho LEE, Young-tak SEO, Soochang LEE, Seongbin OH, Jangsaeng KIM
  • 3D SYNAPSE DEVICE STACK, 3D STACKABLE SYNAPSE ARRAY USING THE 3D SYNAPSE DEVICE STACKS AND METHOD OF FABRICATING THE STACK
    Publication number: 20230059685
    Abstract: Provided is a 3D synapse device stack, a 3D stackable synapse array using the same, and a method for manufacturing the 3D synapse device stack.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 23, 2023
    Inventors: Jong-Ho LEE, Young-tak SEO, Soochang LEE, Seongbin OH, Jangsaeng KIM