Patents by Inventor Seongcheol Jeong
Seongcheol Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12043740Abstract: Provided are a composition for a light transmittance control film, and a light transmittance control film. According to the inventive concept, the light transmittance control film includes a matrix part including a copolymer and a polymer chain which is grafted to the copolymer, and a dispersed part including a polymer derived from a first monomer, and are provided in the matrix part, wherein the polymer chain is derived from the first monomer, first light transmittance is shown while external force is applied, and second light transmittance which is greater than the first light transmittance may be shown after the external force is removed.Type: GrantFiled: May 19, 2021Date of Patent: July 23, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seung Koo Park, Sung Ryul Yun, Ki Uk Kyung, Mi Jeong Choi, Bong Je Park, Suntak Park, Saekwang Nam, Seongcheol Mun, Eun Jin Shin, Jeong Mook Lim
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Patent number: 12032177Abstract: An optical image stabilization OIS unit including a base; a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade; a first coil disposed on the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire electrically connected with the first coil through the spring member; and a buffer unit connected with the wire, wherein the buffer unit has a curved shape having a curvature.Type: GrantFiled: April 28, 2023Date of Patent: July 9, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
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Publication number: 20230266604Abstract: An optical image stabilization OIS unit including a base; a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade; a first coil disposed on the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire electrically connected with the first coil through the spring member; and a buffer unit connected with the wire, wherein the buffer unit has a curved shape having a curvature.Type: ApplicationFiled: April 28, 2023Publication date: August 24, 2023Applicant: LG Innotek Co., Ltd.Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
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Patent number: 11675210Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: GrantFiled: October 18, 2021Date of Patent: June 13, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
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Publication number: 20220035175Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: ApplicationFiled: October 18, 2021Publication date: February 3, 2022Applicant: LG Innotek Co., Ltd.Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
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Patent number: 11175515Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: GrantFiled: February 27, 2020Date of Patent: November 16, 2021Assignee: LG Innotek Co., Ltd.Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
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Publication number: 20200192117Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: ApplicationFiled: February 27, 2020Publication date: June 18, 2020Applicant: LG Innotek Co., Ltd.Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
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Patent number: 10606097Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: GrantFiled: August 8, 2018Date of Patent: March 31, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
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Publication number: 20180348539Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: ApplicationFiled: August 8, 2018Publication date: December 6, 2018Applicant: LG Innotek Co., Ltd.Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
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Patent number: 10067356Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: GrantFiled: December 27, 2016Date of Patent: September 4, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
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Patent number: 9883166Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.Type: GrantFiled: February 2, 2015Date of Patent: January 30, 2018Assignee: LG Innotek Co., Ltd.Inventors: Sangyun Oh, Seongcheol Jeong
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Patent number: 9667868Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.Type: GrantFiled: January 29, 2016Date of Patent: May 30, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Junghyun Lee, Seongcheol Jeong
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Publication number: 20170108706Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: ApplicationFiled: December 27, 2016Publication date: April 20, 2017Applicant: LG Innotek Co., Ltd.Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
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Patent number: 9563067Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: GrantFiled: June 11, 2015Date of Patent: February 7, 2017Assignee: LG Innotek Co., Ltd.Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
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Publication number: 20160150157Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.Type: ApplicationFiled: January 29, 2016Publication date: May 26, 2016Inventors: Junghyun Lee, Seongcheol Jeong
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Patent number: 9258487Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.Type: GrantFiled: July 9, 2012Date of Patent: February 9, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Junghyun Lee, Seongcheol Jeong
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Publication number: 20150277141Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module: a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: ApplicationFiled: June 11, 2015Publication date: October 1, 2015Applicant: LG INNOTEK CO., LTD.Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
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Patent number: 9081205Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.Type: GrantFiled: July 18, 2014Date of Patent: July 14, 2015Assignee: LG Innotek Co., Ltd.Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
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Publication number: 20150145967Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.Type: ApplicationFiled: February 2, 2015Publication date: May 28, 2015Applicant: LG INNOTEK CO., LTD.Inventors: Sangyun OH, Seongcheol JEONG
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Patent number: 8964003Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.Type: GrantFiled: October 7, 2011Date of Patent: February 24, 2015Assignee: LG Innotek Co., Ltd.Inventors: Sangyun Oh, Seongcheol Jeong