Patents by Inventor Seongcheol Jeong

Seongcheol Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12043740
    Abstract: Provided are a composition for a light transmittance control film, and a light transmittance control film. According to the inventive concept, the light transmittance control film includes a matrix part including a copolymer and a polymer chain which is grafted to the copolymer, and a dispersed part including a polymer derived from a first monomer, and are provided in the matrix part, wherein the polymer chain is derived from the first monomer, first light transmittance is shown while external force is applied, and second light transmittance which is greater than the first light transmittance may be shown after the external force is removed.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: July 23, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seung Koo Park, Sung Ryul Yun, Ki Uk Kyung, Mi Jeong Choi, Bong Je Park, Suntak Park, Saekwang Nam, Seongcheol Mun, Eun Jin Shin, Jeong Mook Lim
  • Patent number: 12032177
    Abstract: An optical image stabilization OIS unit including a base; a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade; a first coil disposed on the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire electrically connected with the first coil through the spring member; and a buffer unit connected with the wire, wherein the buffer unit has a curved shape having a curvature.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: July 9, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
  • Publication number: 20230266604
    Abstract: An optical image stabilization OIS unit including a base; a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade; a first coil disposed on the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire electrically connected with the first coil through the spring member; and a buffer unit connected with the wire, wherein the buffer unit has a curved shape having a curvature.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Applicant: LG Innotek Co., Ltd.
    Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
  • Patent number: 11675210
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: June 13, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
  • Publication number: 20220035175
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 3, 2022
    Applicant: LG Innotek Co., Ltd.
    Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
  • Patent number: 11175515
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: November 16, 2021
    Assignee: LG Innotek Co., Ltd.
    Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
  • Publication number: 20200192117
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 18, 2020
    Applicant: LG Innotek Co., Ltd.
    Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
  • Patent number: 10606097
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: March 31, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
  • Publication number: 20180348539
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Application
    Filed: August 8, 2018
    Publication date: December 6, 2018
    Applicant: LG Innotek Co., Ltd.
    Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
  • Patent number: 10067356
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: September 4, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
  • Patent number: 9883166
    Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: January 30, 2018
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sangyun Oh, Seongcheol Jeong
  • Patent number: 9667868
    Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: May 30, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Junghyun Lee, Seongcheol Jeong
  • Publication number: 20170108706
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Application
    Filed: December 27, 2016
    Publication date: April 20, 2017
    Applicant: LG Innotek Co., Ltd.
    Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
  • Patent number: 9563067
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: February 7, 2017
    Assignee: LG Innotek Co., Ltd.
    Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
  • Publication number: 20160150157
    Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.
    Type: Application
    Filed: January 29, 2016
    Publication date: May 26, 2016
    Inventors: Junghyun Lee, Seongcheol Jeong
  • Patent number: 9258487
    Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: February 9, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Junghyun Lee, Seongcheol Jeong
  • Publication number: 20150277141
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module: a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Application
    Filed: June 11, 2015
    Publication date: October 1, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Minsoo KIM, Seongcheol JEONG, Taemin HA, Seonyoung KIM, Junghyun LEE
  • Patent number: 9081205
    Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: July 14, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Minsoo Kim, Seongcheol Jeong, Taemin Ha, Seonyoung Kim, Junghyun Lee
  • Publication number: 20150145967
    Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.
    Type: Application
    Filed: February 2, 2015
    Publication date: May 28, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sangyun OH, Seongcheol JEONG
  • Patent number: 8964003
    Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: February 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sangyun Oh, Seongcheol Jeong