Patents by Inventor Seongdae Shin

Seongdae Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector and Method of Fastening Wires to the Connector
    Publication number: 20240106167
    Abstract: An embodiment connector includes a first housing including a first insertion hole configured to receive a first wire having a first diameter and a through-hole and a second housing having a size corresponding to the through-hole of the first housing, the second housing including a second insertion hole configured to receive a second wire having a second diameter smaller than the first diameter, wherein the second housing is configured to be inserted into the through-hole before assembly to the first housing.
    Type: Application
    Filed: June 15, 2023
    Publication date: March 28, 2024
    Inventors: Min Jae Kim, Jung Jae Lee, Dong Bang Kim, Seongdae Shin