Patents by Inventor Seongdong LIM

Seongdong LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411472
    Abstract: A semiconductor device includes a substrate; an active region extending in a first direction on the substrate; a gate structure extending in a second direction on the substrate and including a gate electrode; a source/drain region provided on the active region on at least one side of the gate structure; an interlayer insulating layer covering the gate structure; a first contact structure connected to the source/drain region on at least one side of the gate structure; and a gate contact structure passing at least partially through the interlayer insulating layer and connected to the gate electrode, wherein the gate contact structure includes: a first layer including a conductive material; a second layer provided on the first layer, spaced apart from the interlayer insulating layer by the first layer, and including first impurities; and a third layer provided on the second layer and including second impurities.
    Type: Application
    Filed: May 8, 2023
    Publication date: December 21, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeongik KIM, Chunghwan SHIN, Jaemoon LEE, Seongdong LIM