Patents by Inventor Seong Hoon BAE

Seong Hoon BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
    Publication number: 20130008938
    Abstract: Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate.
    Type: Application
    Filed: September 16, 2011
    Publication date: January 10, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Kyoung KIM, Seong Hoon BAE, Young Kwan LEE, Su Jin LEE