Abstract: An electronic device according to a certain embodiments comprises: a housing including a front plate, a rear plate, and a side member surrounding a space between the front plate and the rear plate; an antenna module disposed in the space, and configured to transmit and receive first signals belonging to a first frequency band using at least one antenna element; a nonconductive member disposed to face at least one surface of the antenna module; and a conductive pattern being closer to the rear plate than to the at front plate and disposed between the nonconductive member and the rear plate, wherein the conductive pattern is configured to: change a radiation direction of at least a portion of the first signal and transmit and receive a second signal belonging to a second frequency band.

Abstract: A semiconductor device includes a memory cell array that includes a plurality of memory cells electrically connected to a plurality of word lines and a plurality of bit lines, a word line driving circuit that includes a plurality of sub-word line decoders electrically connected to the plurality of word lines, and a control logic configured to determine a selected word line and unselected word lines among the plurality of word lines, and configured to control the word line driving circuit such that at least one of the unselected word lines that is adjacent to the selected word line is floated during at least a portion of a period in which a voltage of the selected word line returns to an initial level.

Abstract: A semiconductor package includes a package substrate including a redistribution layer; a semiconductor chip disposed on the package substrate and electrically connected to the redistribution layer; a wiring structure disposed on the semiconductor chip and having an upper surface on which pads are arranged; a vertical connection structure disposed between the package substrate and the wiring structure and electrically connecting the redistribution layer and the pads; and a passivation layer disposed on the wiring structure and having openings partially exposing a region of each of the pads. The pads include a first pad adjacent to a corner of the wiring structure, and a second pad closer to a center of the wiring structure than the first pad. A first width of the first pad is greater than a second width of the second pad. A contact layer is disposed in the opening on the first pad.

Abstract: A semiconductor package includes a substrate, at least one semiconductor chip arranged in the substrate and having chip pads, and a redistribution wiring layer covering a lower surface of the substrate and including first and second redistribution wirings and dummy patterns, the first and second redistribution wirings being stacked in at least two levels and connected to the chip pads. The first and second redistribution wirings are arranged in a redistribution region of the redistribution wiring layer, and the dummy patterns extend in an outer region outside the redistribution region to partially cover corner portions of the redistribution wiring layer, respectively.

Abstract: A semiconductor package includes a substrate, at least one semiconductor chip arranged in the substrate and having chip pads, and a redistribution wiring layer covering a lower surface of the substrate and including first and second redistribution wirings and dummy patterns, the first and second redistribution wirings being stacked in at least two levels and connected to the chip pads. The first and second redistribution wirings are arranged in a redistribution region of the redistribution wiring layer, and the dummy patterns extend in an outer region outside the redistribution region to partially cover corner portions of the redistribution wiring layer, respectively.

Abstract: A semiconductor package includes a package substrate including a redistribution layer; a semiconductor chip disposed on the package substrate and electrically connected to the redistribution layer; a wiring structure disposed on the semiconductor chip and having an upper surface on which pads are arranged; a vertical connection structure disposed between the package substrate and the wiring structure and electrically connecting the redistribution layer and the pads; and a passivation layer disposed on the wiring structure and having openings partially exposing a region of each of the pads. The pads include a first pad adjacent to a corner of the wiring structure, and a second pad closer to a center of the wiring structure than the first pad. A first width of the first pad is greater than a second width of the second pad. A contact layer is disposed in the opening on the first pad.

Abstract: A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a redistribution layer. A semiconductor chip is disposed on the first surface of the connection structure and has connection pads connected to the redistribution layer. An encapsulant is disposed on the first surface of the connection structure and covers the semiconductor chip. A support pattern is disposed on a portion of an upper surface of the encapsulant. A heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant so as to cover the support pattern. A heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material.

Abstract: A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a redistribution layer. A semiconductor chip is disposed on the first surface of the connection structure and has connection pads connected to the redistribution layer. An encapsulant is disposed on the first surface of the connection structure and covers the semiconductor chip. A support pattern is disposed on a portion of an upper surface of the encapsulant. A heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant so as to cover the support pattern. A heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material.

Abstract: A control apparatus may include an input, an output, a communication device, and a processor. The processor to control the plurality of component devices, and receive the cycle data from the plurality of component devices to enable problem diagnosis on the plurality of component devices, in real time. The processor to display, in a frame, the cycle data for the plurality of component devices, display the cycle data corresponding to actual connection states, installed positions, and present operation states of the plurality of component devices, and change the cycle data thus displayed when the cycle data for the plurality of component devices changes. The cycle data may include data information on whether each of the plurality of component devices is in operation or is not in operation and a cycle change.

Abstract: An apparatus for controlling an air conditioner and a method for operating the same are provided. The apparatus may include a control apparatus that enables easy access to data for the air conditioner, to determine and control an operation state thereof visually, and for which a mode of reception of the data from the air conditioner may be different corresponding to connection modes and positions of a plurality of component devices of the air conditioner to which the control apparatus is connected, making the data received thus different from one another according to the connection modes. These differences in the data permit various data to be easily displayed, enabling a user to change the connection modes as required, and to provide various information on the air conditioner by producing the data of the air conditioner in a frame on an output different from one another.

Abstract: An apparatus for controlling an air conditioner is provided. The apparatus may include a control apparatus connected to one of a plurality of component devices to monitor and control the plurality of component devices. The control apparatus may receive cycle data from the plurality of component devices to enable problem diagnosis on the plurality of component devices connected thereto, in real time, display the cycle data for the plurality of component devices on a frame, and change the cycle data thus displayed if the data on the plurality of component devices changes.

Abstract: An air conditioning system is provided that may include a control apparatus that provides easy access to data for an air conditioner to determine and control an operation state of the air conditioner visually. The air conditioning system may store and manage data received from the air conditioner, and display visually a change in the operation state of the air conditioner with time, enabling a user to easily determine a state of the air conditioner and to instantly recognize a problem with the air conditioner and to easily determine a flow on a whole structure and general operation of the air conditioner, thereby to significantly improving user convenience.

Abstract: An apparatus for controlling an air conditioner and a method for operating the same are provided. The apparatus may include a control apparatus that enables easy access to data for the air conditioner, to determine and control an operation state thereof visually, and for which a mode of reception of the data from the air conditioner may be different corresponding to connection modes and positions of a plurality of component devices of the air conditioner to which the control apparatus is connected, making the data received thus different from one another according to the connection modes. These differences in the data permit various data to be easily displayed, enabling a user to change the connection modes as required, and to provide various information on the air conditioner by producing the data of the air conditioner in a frame on an output different from one another.