Patents by Inventor Seongun EOM

Seongun EOM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 12677684
    Abstract: A semiconductor package substrate including a substrate; a first protective layer disposed on the substrate and including a through hole; and a second protective layer disposed inside the through hole of the first protective layer and spaced apart from the first protective layer, wherein a first edge of the first protective layer faces a first edge of the second protective layer, wherein a space between the first edge of the first protective layer and the first edge of the second protective layer includes at least a first separation region and a second separation region, and wherein a first width of the space in the first separation region is different than a second width of the space in the second separation region.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: July 7, 2026
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Hodol Yoo, Seongun Eom, Yongsoo Lee
  • SEMICONDUCTOR PACKAGE
    Publication number: 20230411268
    Abstract: A semiconductor package substrate including a substrate; a first protective layer disposed on the substrate and including a through hole; and a second protective layer disposed inside the through hole of the first protective layer and spaced apart from the first protective layer, wherein a first edge of the first protective layer faces a first edge of the second protective layer, wherein a space between the first edge of the first protective layer and the first edge of the second protective layer includes at least a first separation region and a second separation region, and wherein a first width of the space in the first separation region is different than a second width of the space in the second separation region.
    Type: Application
    Filed: April 24, 2023
    Publication date: December 21, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Hodol YOO, Seongun EOM, Yongsoo LEE