Patents by Inventor Seon-Haeng LEE

Seon-Haeng LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11670511
    Abstract: A method for fabricating a semiconductor device includes: forming a gate structure including a source side and a drain side over a substrate, wherein a dielectric material and a columnar crystal grain material are stacked over the substrate; doping a chemical species on the drain side of the gate structure; and exposing the gate structure doped with the chemical species to a re-growth process in order to thicken the dielectric material on the drain side of the gate structure.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: June 6, 2023
    Assignee: SK hynix Inc.
    Inventor: Seon-Haeng Lee
  • Publication number: 20210327716
    Abstract: A method for fabricating a semiconductor device includes: forming a gate structure including a source side and a drain side over a substrate, wherein a dielectric material and a columnar crystal grain material are stacked over the substrate; doping a chemical species on the drain side of the gate structure; and exposing the gate structure doped with the chemical species to a re-growth process in order to thicken the dielectric material on the drain side of the gate structure.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 21, 2021
    Inventor: Seon-Haeng LEE
  • Patent number: 11113996
    Abstract: A display according to various embodiments of the present invention may comprise: a touchscreen panel; a display panel disposed under the touchscreen panel and including a first flexible substrate; a drive circuit for driving the touchscreen panel or the display panel; and a second flexible substrate extending outward from the touchscreen panel in a partial layer of the touchscreen panel, wherein the second flexible substrate comprises: a drive circuit area in which the drive circuit is disposed; one or more first wirings connected to the drive circuit and the touchscreen panel; and a bending area which is bent with respect to the touchscreen panel. Various other embodiments may also be possible.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: September 7, 2021
    Inventors: Min-Uk Kim, Hoon-Do Heo, Seon-Haeng Lee, Kwang-Tai Kim
  • Patent number: 11081357
    Abstract: A method for fabricating a semiconductor device includes: forming a gate structure including a source side and a drain side over a substrate, wherein a dielectric material and a columnar crystal grain material are stacked over the substrate; doping a chemical species on the drain side of the gate structure; and exposing the gate structure doped with the chemical species to a re-growth process in order to thicken the dielectric material on the drain side of the gate structure.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: August 3, 2021
    Assignee: SK hynix Inc.
    Inventor: Seon-Haeng Lee
  • Publication number: 20200294428
    Abstract: A display according to various embodiments of the present invention may comprise: a touchscreen panel; a display panel disposed under the touchscreen panel and including a first flexible substrate; a drive circuit for driving the touchscreen panel or the display panel; and a second flexible substrate extending outward from the touchscreen panel in a partial layer of the touchscreen panel, wherein the second flexible substrate comprises: a drive circuit area in which the drive circuit is disposed; one or more first wirings connected to the drive circuit and the touchscreen panel; and a bending area which is bent with respect to the touchscreen panel. Various other embodiments may also be possible.
    Type: Application
    Filed: October 12, 2018
    Publication date: September 17, 2020
    Inventors: Min-Uk KIM, Hoon-Do HEO, Seon-Haeng LEE, Kwang-Tai KIM
  • Publication number: 20200194267
    Abstract: A method for fabricating a semiconductor device includes: forming a gate structure including a source side and a drain side over a substrate, wherein a dielectric material and a columnar crystal grain material are stacked over the substrate; doping a chemical species on the drain side of the gate structure; and exposing the gate structure doped with the chemical species to a re-growth process in order to thicken the dielectric material on the drain side of the gate structure.
    Type: Application
    Filed: August 6, 2019
    Publication date: June 18, 2020
    Inventor: Seon-Haeng LEE