Abstract: An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding layer, and an upper electronic part including an upper substrate disposed on the lower electronic part, and an upper chip structure projecting from the upper substrate, wherein the recessed region of the lower molding layer receives the upper chip structure.

Abstract: An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding layer, and an upper electronic part including an upper substrate disposed on the lower electronic part, and an upper chip structure projecting from the upper substrate, wherein the recessed region of the lower molding layer receives the upper chip structure.

Abstract: A semiconductor package, an electronic device, and an electronic system employing the same are provided. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip structure. A first PCB land region is provided on a first surface of the PCB. A plurality of first chip land regions are provided on a first surface of the semiconductor chip structure which faces the first surface of the PCB. A first connection structure for electrically connecting the first PCB land region to the plurality of first chip land regions is provided.

Abstract: A stack-type semiconductor package, a method of forming the same, and an electronic system including the same are provided. The stack-type semiconductor package includes: a lower printed circuit board having a plurality of connection bumps disposed on an upper surface of the lower printed circuit board and a plurality of lower interconnections; at least one first lower chip sequentially stacked on the lower printed circuit board and electrically connected to the plurality of lower interconnections; a lower molding resin compound disposed on the lower printed circuit board and covering the first lower chips; a double-sided wiring board bonded to the lower molding resin compound and electrically connected to the connection bumps; and an upper chip package bonded to the double-sided wiring board and having upper bumps electrically connected to an interconnection pattern of the double-sided wiring board.

Abstract: An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding layer, and an upper electronic part including an upper substrate disposed on the lower electronic part, and an upper chip structure projecting from the upper substrate, wherein the recessed region of the lower molding layer receives the upper chip structure.