Abstract: A pad conditioner comprising: a disk holder that is rotatable; a frame on the disk holder; a lifting and lowering support member that is between the frame and the disk holder; a posture adjusting member that is between the lifting and lowering support member and the frame and has a thickness, wherein the posture adjusting member is capable of varying the thickness; a posture sensor that is configured to detect a height of the lifting and lowering support member; and a controller that is configured to vary the thickness of the posture adjusting member according to a signal received from the posture sensor.

Abstract: A polishing head of a CMP apparatus may include a head block, a distribution block and a segmentation type head module. The head block may configured to be positioned over a substrate. The distribution block may be rotatably connected to a lower surface of the head block with respect to a vertical direction. A plurality of pressure lines may be connected to the distribution block and configured to flow a working fluid therethrough. The segmentation type head module may be connected to the lower surface of the distribution block. The segmentation type head module may be configured to rotate with respect to the vertical direction together with the distribution block. The segmentation type head module may be configured to locally pressurize the substrate using the working fluid provided through the pressure lines.