Patents by Inventor Seoung Jae Lee
Seoung Jae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8003173Abstract: The present invention relates to a method for forming a photoresist-laminated substrate including: preparing a laminated substrate having an insulating substrate and a metal layer; coating with an aerosol of metal nanoparticles on the metal layer; laminating a photoresist film on the metal layer coated with the aerosol of metal nanoparticles. The method of the present invention is a environmentally friendly method since an aerosol of metal nanoparticles is used, differentiated from the conventional wet process.Type: GrantFiled: January 4, 2008Date of Patent: August 23, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hee-Sung Choi, Bae-Kyun Kim, Mi-Yang Kim, Seoung-Jae Lee
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Patent number: 7993418Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of theType: GrantFiled: January 19, 2010Date of Patent: August 9, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Patent number: 7982138Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.Type: GrantFiled: February 11, 2009Date of Patent: July 19, 2011Assignees: Samsung Electro-Mechanics Co., Ltd., Samsung LED Co., Ltd.Inventors: Jin-Hak Choi, Seoung-Jae Lee, Bae-Kyun Kim, Eun-Ju Yang, Jong-Yun Kim, Yeo-Joo Yoon
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Patent number: 7969710Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of theType: GrantFiled: January 8, 2008Date of Patent: June 28, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Publication number: 20100115746Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of theType: ApplicationFiled: January 19, 2010Publication date: May 13, 2010Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hee Sung CHOI, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Publication number: 20100059257Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.Type: ApplicationFiled: February 11, 2009Publication date: March 11, 2010Inventors: Jin-Hak CHOI, Seoung-Jae Lee, Bae-Kyun Kim, Eun-Ju Yang, Jong-Yun Kim, Yeo-Joo Yoon
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Patent number: 7633740Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one end is inserted into the capacitor element and the other end projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.Type: GrantFiled: January 8, 2008Date of Patent: December 15, 2009Assignee: Samsung Electro-Mechanics Co. Ltd.Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Patent number: 7619875Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire inserted and connected to a lower portion of the capacitor element; a cathode extraction layer formed on the capacitor element; an anode lead frame provided on one side of the lower surface of the capacitor element so as to be electrically insulated from the cathode extraction layer, the anode lead frame having an insertion portion into which a projecting lower portion of the anode wire is inserted; a cathode lead frame provided on the other side of the lower surface of the capacitor element so as to be electrically connected to the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the lower end surface of the anode wire, the lower surface of the anode lead frame, and the lower surface of the cathode lead frame; an anode lead terminal provided on the molding portion so as to be electrically connected to the lower end surface of the anode wire and theType: GrantFiled: January 8, 2008Date of Patent: November 17, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Publication number: 20090277679Abstract: Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole; substituting the zinc film with a metal film by performing substitution plating on the zinc film; forming a first plated film on the surface of the via hole, where the metal film is formed, through electroless plating; and forming a second plated film on the first plated film through electroplating.Type: ApplicationFiled: July 25, 2008Publication date: November 12, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ha Yong Jung, Dek Gin Yang, Cheol Ho Heo, Chan-Yeup Chung, Keun Ho Kim, Seoung Jae Lee
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Publication number: 20090154066Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire inserted and connected to a lower portion of the capacitor element; a cathode extraction layer formed on the capacitor element; an anode lead frame provided on one side of the lower surface of the capacitor element so as to be electrically insulated from the cathode extraction layer, the anode lead frame having an insertion portion into which a projecting lower portion of the anode wire is inserted; a cathode lead frame provided on the other side of the lower surface of the capacitor element so as to be electrically connected to the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the lower end surface of the anode wire, the lower surface of the anode lead frame, and the lower surface of the cathode lead frame; an anode lead terminal provided on the molding portion so as to be electrically connected to the lower end surface of the anode wire and theType: ApplicationFiled: January 8, 2008Publication date: June 18, 2009Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Publication number: 20090154065Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one end is inserted into the capacitor element and the other end projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.Type: ApplicationFiled: January 8, 2008Publication date: June 18, 2009Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Publication number: 20090154068Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of theType: ApplicationFiled: January 8, 2008Publication date: June 18, 2009Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
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Publication number: 20090139875Abstract: Disclosed is an electrolyte for electrochemical machining of a metal product, which can reduce a defect of an electro-chemical machining product, increase a lifespan of an electrolyte and an electrode, and improve efficiency of the electrochemical machining. The electrolyte includes an inorganic salt and at least one of a complexing agent and a reducing agent in a solvent.Type: ApplicationFiled: October 3, 2008Publication date: June 4, 2009Inventors: Jong Yun KIM, Seoung Jae Lee, Bae Kyun Kim, Young Tae Kim, Mi Jin Choi
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Publication number: 20080220373Abstract: The present invention relates to a method for forming a photoresist-laminated substrate including: preparing a laminated substrate having an insulating substrate and a metal layer; coating with an aerosol of metal nanoparticles on the metal layer; laminating a photoresist film on the metal layer coated with the aerosol of metal nanoparticles. The method of the present invention is a environmentally friendly method since an aerosol of metal nanoparticles is used, differentiated from the conventional wet process.Type: ApplicationFiled: January 4, 2008Publication date: September 11, 2008Inventors: Hee-Sung Choi, Bae-Kyun Kim, Mi-Yang Kim, Seoung-Jae Lee
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Publication number: 20060243780Abstract: The present invention relates to a conductive substrate, motor, vibration motor, and metal terminal for electrical contact having a gold-copper layer which improves electrical conductivity and abrasion resistance and excellent electrical durability. According to a preferred embodiment of the invention, a conductive substrate which comprises a base board, a copper layer formed on least one side of the base board and made of copper or a copper alloy, and a gold-copper layer formed on the copper layer and made of gold and copper alloy.Type: ApplicationFiled: April 28, 2006Publication date: November 2, 2006Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seoung-Jae Lee, Bae-Kyun Kim, Sang-Gil An, Kum-Young Ji, Young-Tae Kim