Patents by Inventor Seoung-Won Kim

Seoung-Won Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210360798
    Abstract: A printed circuit board includes a rigid part including a central insulating layer for insulation, inner copper foil layers including a first conductive circuit portion, outer insulating layers for insulation, and outer copper foil layers including a second conductive circuit portion, wherein ones of the inner copper foil layers, the outer insulating layers, and the outer copper foil layers are symmetrically positioned on opposite sides of the central insulating layer and are sequentially laminated, and a flexible part formed by selectively removing a portion of the rigid part up to one side of the central insulating layer.
    Type: Application
    Filed: February 19, 2021
    Publication date: November 18, 2021
    Inventors: SeungWoo Choi, Seong-Rae Cho, Seoung-Won Kim, Hyeok-Jin Jeong