Patents by Inventor Seow Tang

Seow Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with semiconductor device components embedded in plastic package compound
    Publication number: 20070200258
    Abstract: A semiconductor device includes semiconductor device components embedded in plastic package compound, with a buffer layer being arranged on surfaces of the semiconductor device components of the semiconductor device. The buffer layer includes a thermoplastic material.
    Type: Application
    Filed: October 5, 2006
    Publication date: August 30, 2007
    Inventors: Joachim Mahler, Seow Tang