Abstract: A liquid cooler including a heat sink. A hollow body is produced by extrusion having at least one flat outer surface between a first and a second end. At least one elongated cavity passes through the body from the first to the second end. The hollow body includes a plurality of parallel fins directed into and along the at least one cavity. An insert housed in the at least one cavity connects the tops of the fins in a fluid-tight manner thereby forming liquid channels for a coolant liquid between the insert and the hollow body. A lid is attached at both ends of the hollow body for forming a liquid cooling system.

Abstract: A liquid cooler including a heat sink. A hollow body is produced by extrusion having at least one flat outer surface between a first and a second end. At least one elongated cavity passes through the body from the first to the second end. The hollow body includes a plurality of parallel fins directed into and along the at least one cavity. An insert housed in the at least one cavity connects the tops of the fins in a fluid-tight manner thereby forming liquid channels for a coolant liquid between the insert and the hollow body. A lid is attached at both ends of the hollow body for forming a liquid cooling system.

Abstract: The present invention relates to thermosyphons, in particular for use in the cooling of electronic components. In a first embodiment a thermosyphon is manufactured by extruding a base (1) and milling a channel structure in the base to produce a plurality of fins (5) extending vertically from the base. A lid (3) comprising a number of fins (4) extending vertically from the lid is placed over the heat sink channel structure so that a thermosyphon of an expanding channel system is formed. In a second embodiment the evaporator and condenser sections are separated and connected by pipes. To form a leak proof seal between the lid and the base, joining is preferably done by friction stir welding. By providing an extruded thermosyphon, heat transfer is made more efficient than when junctions are used. The present invention provides a new way of efficiently manufacturing an integrated structure, while keeping the heat transfer of the structure high.