Patents by Inventor Sepung KI

Sepung KI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210304943
    Abstract: The present invention provides a coil device which includes two coil elements in the same device and achieves an improved wire occupancy. The coil device includes a core including a winding core, and a winding wire part of which a first wire and a second wire are wound in a plurality of layers around the winding core, wherein the winding wire part includes a first part in which the first wire and the second wire of a same turn are wound adjacent to each other on a same layer, and a second part in which the first wire and the second wire of a same turn are wound in different layers without being adjacent to each other.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 30, 2021
    Applicants: TDK CORPORATION, TDK KOREA CORPORATION
    Inventors: Kiyofumi FUJIWARA, Hiroyuki IWATA, Eietsu ABE, Sepung KI, Chihu AN
  • Publication number: 20210225580
    Abstract: A coil device including a magnetic core having a winding core around which a wire is wound to form a coil, and four terminal electrodes attached to an outer end surface of a flange formed at an end of the winding core along a winding axis. A recess is formed on the outer end surface of the flange, and each of the terminal electrodes includes a first rising piece loosely entering the recess, and a mounting piece integrally formed with the first rising piece and adhered to the outer end surface of the flange.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 22, 2021
    Applicants: TDK CORPORATION, TDK KOREA CORPORATION
    Inventors: Hiroyuki IWATA, Kiyofumi FUJIWARA, Sepung KI, Chihu AN