Abstract: A flip-chip interconnect structure for a RFID tag is described which permits the use of an isotropic electrically conductive adhesive (ECA) without requirement of critical alignment of the chip terminal pads to antenna terminals on the substrate. The interconnect foot print utilizes design principles of standard discrete SMD terminal footprint, which does not require alignment accuracy of a NCA/ACA flip chip bonder. The use of an ECA also eliminates the need for curing the adhesive while under heat and pressure on the chip placement machine. Because of the wide placement tolerance the chips can be placed with a low cost highly productive SMT placement machine. After placement, the assemblies leave the placement machine and are cured in an oven, thereby further improving the productivity of the placement machine. Further productivity improvement is realized by the elimination of bumping which is no longer required.

Abstract: A sensor array integrated electrochemical chip is provided wherein the chip has an array of electrodes. The array may be formed on a base plate bonded to a cover plate having an opening. The opening can be a window or a depression. The plates are bounded such that they define a cavity, with the array being within the cavity. Conducting lines for connecting the electrodes to electrochemical instruments may be formed on the same surface of the base plate on which the electrodes are formed. At least one of the electrodes may be covered by a coating doped with a ferrocene compound. The coating may be a supported bilayer lipid membrane doped with benzoylferrocene. The doped ferrocene compound may be oxidized.