Abstract: A resonator oscillator that may be included in a gas sensing system may include an oscillator that may be electrically connected to an external resonator through a conductive line. The oscillator may generate an oscillating signal having a frequency corresponding to a resonance frequency of the external resonator in an oscillating path. A spurious resonance removal circuit on the oscillating path may remove spurious resonance caused by the conductive line from the oscillating path. A gas sensing system may include the oscillator, a resonator that includes a sensor configured to sense a gas, and a frequency counting logic that receives the oscillating signal and a reference clock signal, performs a counting operation on the oscillating signal according to a logic state of the reference clock signal to generate a counted value, and generate a gas sensing output indicating a sensed gas based on the counted value.

Abstract: A semiconductor chip includes a semiconductor circuit layer and a semiconductor thermoelectric layer disposed on a substrate. The circuit layer includes a first circuit and a second circuit disposed horizontally in a first direction. The thermoelectric layer includes a first on-die thermoelectric element, where the thermoelectric layer is disposed on the circuit layer including the first circuit and the second circuit. The first on-die thermoelectric element is configured to distribute heat generated at the first circuit horizontally in the first direction toward the second circuit.

Abstract: A resonator oscillator that may be included in a gas sensing system may include an oscillator that may be electrically connected to an external resonator through a conductive line. The oscillator may generate an oscillating signal having a frequency corresponding to a resonance frequency of the external resonator in an oscillating path. A spurious resonance removal circuit on the oscillating path may remove spurious resonance caused by the conductive line from the oscillating path. A gas sensing system may include the oscillator, a resonator that includes a sensor configured to sense a gas, and a frequency counting logic that receives the oscillating signal and a reference clock signal, performs a counting operation on the oscillating signal according to a logic state of the reference clock signal to generate a counted value, and generate a gas sensing output indicating a sensed gas based on the counted value.

Abstract: A thermoelectric element is provided as follows. First and second semiconductor fin structures are disposed on a semiconductor substrate. Each semiconductor fin structure extends in a first direction, protruding from the semiconductor substrate. First and second semiconductor nanowires are disposed on the first and second semiconductor fin structures, respectively. The first semiconductor nanowires include first impurities. The second semiconductor nanowires include second impurities different from the first impurities. A first electrode is connected to first ends of the first and second semiconductor nanowires. A second electrode is connected to second ends of the first semiconductor nanowires. A third electrode is connected to second ends of the second semiconductor nanowires.

Abstract: A thermoelectric element is provided as follows. First and second semiconductor fin structures are disposed on a semiconductor substrate. Each semiconductor fin structure extends in a first direction, protruding from the semiconductor substrate. First and second semiconductor nanowires are disposed on the first and second semiconductor fin structures, respectively. The first semiconductor nanowires include first impurities. The second semiconductor nanowires include second impurities different from the first impurities. A first electrode is connected to first ends of the first and second semiconductor nanowires. A second electrode is connected to second ends of the first semiconductor nanowires. A third electrode is connected to second ends of the second semiconductor nanowires.

Abstract: A semiconductor chip includes a semiconductor circuit layer and a semiconductor thermoelectric layer disposed on a substrate. The circuit layer includes a first circuit and a second circuit disposed horizontally in a first direction. The thermoelectric layer includes a first on-die thermoelectric element, where the thermoelectric layer is disposed on the circuit layer including the first circuit and the second circuit. The first on-die thermoelectric element is configured to distribute heat generated at the first circuit horizontally in the first direction toward the second circuit.