Patents by Inventor Sera Kim

Sera Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same
    Patent number: 11702571
    Abstract: An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: July 18, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Sera Kim, Ji Ho Han, Kwang Joo Lee
  • Back-grinding tape
    Patent number: 11466178
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Eun Yeong Kim, Sera Kim, Kwang Joo Lee, Sang Hwan Kim, Sung Chan Park, Mi Seon Yoon
  • Adhesive composition
    Patent number: 11466184
    Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Jang, Sera Kim, Ji Ho Han, Kwang Joo Lee, Bora Yeon, Kwang Su Seo
  • Back grinding tape
    Patent number: 11424153
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 23, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Seon Yoon, Sera Kim, Kwang Joo Lee, Bora Yeon, Sang Hwan Kim, Eun Yeong Kim
  • Methods for Treating TNFa-Related Diseases
    Publication number: 20220153828
    Abstract: The present prevention relates to methods for treating TNF?-related diseases by subcutaneously administering an antibody binding to TNF? (anti-TNF? antibody) or an antigen-binding fragment thereof. The treatment method, composition, kit or use according to the present invention provide an advantage of improving patient satisfaction, by improving convenience and quality of life, that is, by reducing the time required for administration and decreasing the length of stay of patients in a hospital compared to intravenous injection.
    Type: Application
    Filed: February 28, 2020
    Publication date: May 19, 2022
    Inventors: Sun Jung Kim, Sera Kim, Jee Hye Suh, Si Young Yang, Joon Ho Lee, So Hye Jo, Jin Sun Jung, Sun Hee Lee
  • Method for manufacturing heating element
    Patent number: 11178730
    Abstract: The present specification relates to a heating element and a method for manufacturing the same.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: November 16, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Ji Eun Myung, Sera Kim, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song, Kwang Joo Lee, Ji Young Hwang
  • ADHESIVE SHEET FOR TEMPORARY FIXATION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20210171802
    Abstract: An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.
    Type: Application
    Filed: March 28, 2019
    Publication date: June 10, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Sera KIM, Ji Ho HAN, Kwang Joo LEE
  • ADHESIVE COMPOSITION
    Publication number: 20210155831
    Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.
    Type: Application
    Filed: June 17, 2019
    Publication date: May 27, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Mi JANG, Sera KIM, Ji Ho HAN, Kwang Joo LEE, Bora YEON, Kwang Su SEO
  • ADHESIVE SHEET FOR TEMPORARY ATTACHMENT AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20210032501
    Abstract: The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.
    Type: Application
    Filed: April 11, 2019
    Publication date: February 4, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Sera KIM, Ji Ho HAN, Mi JANG, Kwang Joo LEE
  • BACK GRINDING TAPE
    Publication number: 20210035847
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Application
    Filed: June 4, 2019
    Publication date: February 4, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Mi Seon YOON, Sera KIM, Kwang Joo LEE, Bora YEON, Sang Hwan KIM, Eun Yeong KIM
  • BACK-GRINDING TAPE
    Publication number: 20210002518
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Application
    Filed: March 7, 2019
    Publication date: January 7, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Eun Yeong KIM, Sera KIM, Kwang Joo LEE, Sang Hwan KIM, Sung Chan PARK, Mi Seon YOON
  • Heating element
    Patent number: 10796818
    Abstract: The present specification relates to a heating element and a method for manufacturing the same.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: October 6, 2020
    Assignee: LG CHEM., LTD.
    Inventors: Ji Eun Myung, Sera Kim, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song, Kwang Joo Lee, Ji Young Hwang
  • HEATING ELEMENT
    Publication number: 20190080820
    Abstract: The present invention relates to a heating element and a method for manufacturing same, and more specifically, a heating element and a method for manufacturing same is provided, the heating element comprising: an adhesive film; and a conductive heating pattern provided on the adhesive film, wherein the adhesive film has a rate of adhesive force reduction due to an external stimulus of at least 30% with respect to the adhesive force thereof prior to the application of an external stimulus.
    Type: Application
    Filed: December 23, 2016
    Publication date: March 14, 2019
    Inventors: Ji Eun MYUNG, Sera KIM, Jooyeon KIM, Chang Yoon LIM, Seung Heon LEE, Mun Seop SONG, Kwang Joo LEE, Ji Young HWANG
  • Pressure-sensitive adhesive composition
    Patent number: 7462663
    Abstract: The present invention relates to a pressure-sensitive adhesive composition, and more precisely, a pressure-sensitive adhesive composition containing an organic silane compound that exhibits excellent initial adhesive strength on a substrate, and does not leave any of the adhesive behind when removed because the adhesive power is not excessively increased even at high temperature or at high temperature and high humidity.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: December 9, 2008
    Assignee: LG Chem, Ltd.
    Inventors: Michael J. Kim, Noma Kim, Sera Kim, Sukky Chang
  • Organic silane compound
    Patent number: 7262313
    Abstract: The present invention relates to a novel organic silane compound, and more particularly, to a novel organic silane compound, useful in various applications, for the purpose of improving the affinity of an organic resin to an inorganic filler or improving the adhesion of a coating layer comprising matrix resin to a substrate. It is particularly useful for improving the adhesion of a polarizing plate adhesive for a liquid crystal display to a glass substrate, with little change over time even under hot and humid conditions.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: August 28, 2007
    Assignee: LG Chem, Ltd.
    Inventors: Michael J. Kim, Noma Kim, Anna Lee, Sera Kim, Sukky Chang, Sungchul Lim
  • Organic silane compound
    Publication number: 20070093671
    Abstract: The present invention relates to a novel organic silane compound, and more particularly, to a novel organic silane compound, useful in various applications, for the purpose of improving the affinity of an organic resin to an inorganic filler or improving the adhesion of a coating layer comprising matrix resin to a substrate. It is particularly useful for improving the adhesion of a polarizing plate adhesive for a liquid crystal display to a glass substrate, with little change over time even under hot and humid conditions.
    Type: Application
    Filed: October 19, 2006
    Publication date: April 26, 2007
    Applicant: LG CHEM, LTD.
    Inventors: Michael Kim, Noma Kim, Anna Lee, Sera Kim, Sukky Chang, Sungchul Lim
  • Pressure-sensitive adhesive composition
    Publication number: 20070093577
    Abstract: The present invention relates to a pressure-sensitive adhesive composition, and more precisely, a pressure-sensitive adhesive composition containing an organic silane compound that exhibits excellent initial adhesive strength on a substrate, and does not leave any of the adhesive behind when removed because the adhesive power is not excessively increased even at high temperature or at high temperature and high humidity.
    Type: Application
    Filed: October 20, 2006
    Publication date: April 26, 2007
    Applicant: LG CHEM, LTD.
    Inventors: Michael Kim, Noma Kim, Sera Kim, Sukky Chang