Abstract: A communication device having multi-module assembly is provided. The communication device includes a body, a first communication module and a second communication module. The body has a front side, a rear side and a plurality of lateral sides. The front side and the rear side both have a length dimension and a width dimension, and the lateral sides have a thickness dimension. The body is a combination of a plurality of housings with the same length dimension and the same width dimension, and the rear side of a housing ahead is connected with the front side of another housing behind. The first communication module is disposed in a first housing of the body. The second communication module is disposed in a second housing of the body.

Abstract: An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several rims surrounding the opening. The communication chip, disposed on the circuit board, is located in the opening of the frame. The first heat sink, disposed on the communication chip, has a first surface facing and contacting the communication chip. The fixer is fixed into the circuit board and the first heat sink, such that the first heat sink remains contacting the communication chip. The shielding mask, disposed on the circuit board, includes a cover and several side boards. The cover covers the communication chip and the first heat sink, such that the cover contacts a second surface of the first heat sink. The side boards are opposite and connected to the rims in parallel.