Abstract: A power electronics assembly may include a power electronics device, a packaging assembly, a thermal management system, and an emitter. The packaging assembly supports power electronics device. The thermal management system supports the packaging assembly and includes a thermal plate to deliver coolant for thermally communicating with the device. The thermal plate defines a channel with a wall. The emitter is arranged with the wall to form a peristaltic pump to adjust a cross-sectional area of the channel to control a flow of coolant therethrough. A membrane may be partially secured to the wall and include one of dielectric particles or magnetic particles. The emitter may selectively output one of a voltage, an electric field, or a magnetic field to impart a force on the particles to move the membrane and adjust the cross-sectional area of the channel to control a flow of coolant therethrough.

Abstract: A power electronics assembly may include a power electronics device, a packaging assembly, a thermal management system, and an emitter. The packaging assembly supports power electronics device. The thermal management system supports the packaging assembly and includes a thermal plate to deliver coolant for thermally communicating with the device. The thermal plate defines a channel with a wall. The emitter is arranged with the wall to form a peristaltic pump to adjust a cross-sectional area of the channel to control a flow of coolant therethrough. A membrane may be partially secured to the wall and include one of dielectric particles or magnetic particles. The emitter may selectively output one of a voltage, an electric field, or a magnetic field to impart a force on the particles to move the membrane and adjust the cross-sectional area of the channel to control a flow of coolant therethrough.

Abstract: A power module assembly includes opposing end caps collectively having coolant ports and a row of cards that each have a major side defining a projection extending across the card. A side panel extends between the end caps such that the panel and row define a channel in fluid communication with the ports and configured to convey coolant directly across the cards. The side panel defines a groove that receives the projections.

Abstract: A power module assembly includes opposing end caps collectively having coolant ports and a row of cards that each have a major side defining a projection extending across the card. A side panel extends between the end caps such that the panel and row define a channel in fluid communication with the ports and configured to convey coolant directly across the cards. The side panel defines a groove that receives the projections.

Abstract: A power inverter includes an array of stacked cards each having switches arranged to transform direct current from a battery into alternating current (AC). Each of the cards also includes a first terminal attached to some of the switches and configured to pass AC therefrom to a first electric machine, and a second terminal attached to other of the switches and configured to pass AC therefrom to a second electric machine. First and second substrates of the power inverter sandwich the switches and terminals.

Abstract: Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane.

Abstract: Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane.

Abstract: The invention is a low-cost, compact radar for adaptively forming beams and independently steering the beams to improve the noise and sensitivity of the radar. The radar includes a printed circuit board, a low-cost multi-layer organic substrate, and a three dimensional (3D) radio frequency (RF) front end that is flood mounted on the substrate.

Abstract: The invention is a low-cost, compact radar for adaptively forming beams and independently steering the beams to improve the noise and sensitivity of the radar. The radar includes a printed circuit board, a low-cost multi-layer organic substrate, and a three dimensional (3D) radio frequency (RF) front end that is flood mounted on the substrate.