Abstract: A display panel includes an array of display pixels to output an image. The array of display pixels includes a central pixel region and a perimeter pixel region. The central pixel region includes central pixel units each having three different colored sub-pixels. The different colored sub-pixels of the central pixel units are organized according to a central layout pattern that repeats across the central pixel region. The perimeter pixel region is disposed along a perimeter of the central pixel region and includes perimeter pixel units that increase a brightness of the image along edges of the central pixel region to mask gaps around the array of display pixels when tiling the array of display pixels with other arrays of display pixels.

Abstract: A device according to embodiments of the invention includes a waveguide, typically formed from a first section of transparent material. A light source is disposed proximate a bottom surface of the waveguide. The light source comprises a semiconductor light emitting diode and a second section of transparent material disposed between the semiconductor light emitting diode and the waveguide. Sidewalls of the second section of transparent material are reflective. A surface to be illuminated is disposed proximate a top surface of the waveguide. In some embodiments, an edge of the waveguide is curved.

Abstract: A multi-layer projection screen includes a stray light rejection layer and a lens array. The stray light rejection layer includes an array of pillar structures, wherein each pillar structure of the array of pillar structures includes an entrance aperture, an exit aperture, a pathway extending from the entrance aperture to the exit aperture, and a side wall surrounding the pathway. The lens array is optically aligned to the array of pillar structures. The stray light rejection layer blocks display light received from the lens array having an oblique trajectory that is greater than a threshold angle from a first trajectory.

Abstract: An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

Abstract: A light emitting diode (LED) based illumination device include a plurality of LEDS mounted to mounting board and includes a transmissive plate disposed above the LEDs. The transmissive plate includes an amount of wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs. A base reflector structure is coupled to the LED mounting board and the transmissive plate between at least two of the LEDs. In another configuration, a dam of reflective material surrounds the LEDs and is coupled to the LED mounting board and the transmissive plate, while a dam of thermally conductive material surrounds the dam of reflective material. In another configuration, the LED mounting board has a protrusion of thermally conductive material that surrounds the LEDs and is coupled to the transmissive plate, and has a void on the side opposite the protrusion.

Abstract: An illumination module includes a color conversion cavity with a first interior surface having a first wavelength converting material and a second interior surface having a second wavelength converting material. A first LED is configured to receive a first current and to emit light that preferentially illuminates the first interior surface. A second LED is configured to receive a second current and emit light that preferentially illuminates the second interior surface. The first current and the second current are selectable to achieve a range of correlated color temperature (CCT) of light output by the LED based illumination device.

Abstract: A display panel includes an array of display pixels to output an image. The array of display pixels includes a central pixel region and a perimeter pixel region. The central pixel region includes central pixel units each having three different colored sub-pixels. The different colored sub-pixels of the central pixel units are organized according to a central layout pattern that repeats across the central pixel region. The perimeter pixel region is disposed along a perimeter of the central pixel region and includes perimeter pixel units that increase a brightness of the image along edges of the central pixel region to mask gaps around the array of display pixels when tiling the array of display pixels with other arrays of display pixels.

Abstract: A multi-layer projection screen includes a stray light rejection layer and a lens array. The stray light rejection layer includes an array of pillar structures, wherein each pillar structure of the array of pillar structures includes an entrance aperture, an exit aperture, a pathway extending from the entrance aperture to the exit aperture, and a side wall surrounding the pathway. The lens array is optically aligned to the array of pillar structures. The stray light rejection layer blocks display light received from the lens array having an oblique trajectory that is greater than a threshold angle from a first trajectory.

Abstract: A multi-layer projection screen includes a transparent substrate having first and second sides, a stray light rejection layer, and a lens array. The stray light rejection layer is disposed across the first side of the transparent substrate. The stray light rejection layer includes an array of pillar structures, wherein each pillar structure of the array of pillar structures includes an entrance aperture, an exit aperture, a substantially transparent pathway extending from the entrance aperture to the exit aperture, and an opaque side wall surrounding the transparent pathway. The lens array is disposed across the second side of the transparent substrate and optically aligned to the array of pillar structures. The stray light rejection layer blocks display light received from the lens array having an oblique trajectory that is greater than a threshold angle from a normal of the second side of the transparent substrate.

Abstract: A light emitting diode (LED) based illumination device include a plurality of LEDS mounted to mounting board and includes a transmissive plate disposed above the LEDs. The transmissive plate includes an amount of wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs. A base reflector structure is coupled to the LED mounting board and the transmissive plate between at least two of the LEDs. In another configuration, a dam of reflective material surrounds the LEDs and is coupled to the LED mounting board and the transmissive plate, while a dam of thermally conductive material surrounds the dam of reflective material. In another configuration, the LED mounting board has a protrusion of thermally conductive material that surrounds the LEDs and is coupled to the transmissive plate, and has a void on the side opposite the protrusion.

Abstract: A multi-layer projection screen includes a transparent substrate having first and second sides, a stray light rejection layer, and a lens array. The stray light rejection layer is disposed across the first side of the transparent substrate. The stray light rejection layer includes an array of pillar structures, wherein each pillar structure of the array of pillar structures includes an entrance aperture, an exit aperture, a substantially transparent pathway extending from the entrance aperture to the exit aperture, and an opaque side wall surrounding the transparent pathway. The lens array is disposed across the second side of the transparent substrate and optically aligned to the array of pillar structures. The stray light rejection layer blocks display light received from the lens array having an oblique trajectory that is greater than a threshold angle from a normal of the second side of the transparent substrate.

Abstract: An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

Abstract: An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

Abstract: A device according to embodiments of the invention includes a waveguide, typically formed from a first section of transparent material. A light source is disposed proximate a bottom surface of the waveguide. The light source comprises a semiconductor light emitting diode and a second section of transparent material disposed between the semiconductor light emitting diode and the waveguide. Sidewalls of the second section of transparent material are reflective. A surface to be illuminated is disposed proximate a top surface of the waveguide. In some embodiments, an edge of the waveguide is curved.

Abstract: A device according to embodiments of the invention includes a waveguide, typically formed from a first section of transparent material. A light source is disposed proximate a bottom surface of the waveguide. The light source comprises a semiconductor light emitting diode and a second section of transparent material disposed between the semiconductor light emitting diode and the waveguide. Sidewalls of the second section of transparent material are reflective. A surface to be illuminated is disposed proximate a top surface of the waveguide. In some embodiments, an edge of the waveguide is curved.

Abstract: A light emitting diode (LED) based illumination device include a plurality of LEDS mounted to mounting board and includes a transmissive plate disposed above the LEDs. The transmissive plate includes an amount of wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs. A base reflector structure is coupled to the LED mounting board and the transmissive plate between at least two of the LEDs. In another configuration, a dam of reflective material surrounds the LEDs and is coupled to the LED mounting board and the transmissive plate, while a dam of thermally conductive material surrounds the dam of reflective material. In another configuration, the LED mounting board has a protrusion of thermally conductive material that surrounds the LEDs and is coupled to the transmissive plate, and has a void on the side opposite the protrusion.

Abstract: A rear projection screen includes an array of pin-hole apertures to pass display light incident from a first side of the rear projection screen through to a viewing side of the rear projection screen opposite the first side. An array of concentrator structures surrounds the pin-hole apertures and defines concentrating optical pathways. The concentrating optical pathways each have an input aperture for collecting the display light and an output defined by a corresponding one of the pin-hole apertures to emit the display light. The input apertures are larger than the pin-hole apertures.

Abstract: A multi-chip light emitting device (LED) uses a low-cost carrier structure that facilitates the use of substrates that are optimized to support the devices that require a substrate. Depending upon the type of LED elements used, some of the LED elements may be mounted on the carrier structure, rather than on the more expensive ceramic substrate. In like manner, other devices, such as sensors and control elements, may be mounted on the carrier structure as well. Because the carrier and substrate structures are formed independent of the encapsulation and other after-formation processes, these structures can be tested prior to encapsulation, thereby avoiding the cost of these processes being applied to inoperative structures.

Abstract: A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier.

Abstract: An illumination module includes a color conversion cavity with a first interior surface having a first wavelength converting material and a second interior surface having a second wavelength converting material. A first LED is configured to receive a first current and to emit light that preferentially illuminates the first interior surface. A second LED is configured to receive a second current and emit light that preferentially illuminates the second interior surface. The first current and the second current are selectable to achieve a range of correlated color temperature (CCT) of light output by the LED based illumination device.