Abstract: An intelligent cabinet for dispensing products contained therein that includes an outer wall, an inner liner defining an enclosed interior space adapted for housing an inventory of items, an intermediate layer provided between the outer wall and inner liner, and having a plurality of slots, and a system of modular cassettes including a plurality of cassettes where each cassette is adapted to be fittingly received in and removable from a corresponding slot from the plurality of slots, and a plurality of RFID antennas, where each RFID antennas is separately housed in one of the cassettes from among the plurality of cassettes

Abstract: A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

Abstract: A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

Abstract: Allergens are contained in strictly controlled and reproducible amounts on solid supports to provide a progressive release of the allergen perlingually and sublingually. The compositions are prepared by dissolving an allergen in a polar solvent to obtain a mother solution; preparing dilutions of different predetermined concentrations; fractionating each of the dilutions into sub-dilutions; and impregnating a pharmaceutically acceptable solid support with each sub-dilution, each impregnation step being followed by drying in forced, dried air at a temperature not greater than 30.degree. C.; and applying a protective coating onto the composition.

Abstract: New galenical forms for administering beta-2-mimetics comprising a support conditioned to be placed into the sublingual and perlingual cavity of the mouth, the support made of a pharmaceutically acceptable compound which disintegrates under the action of saliva and progressively releases a controlled amount of the beta-2-mimetics into the sublingual and perlingual cavity of the mouth.

Abstract: In these new galenical forms the corticoid is contained, in strictly controlled and reproducible amounts, in solid supports provided for an extended release of the active ingredient perlingually and sublingually.The corticoid is preferably methylprednisolone.The galenical forms can be prepared as follows:dissolving the corticoid in a solvent,preparing dilutions with different concentrations,fractionating each of these dilutions into subdilutions,impregnating by multi-impregnation or fractionated impregnation a pharmaceutically acceptable solid support with each of the subdilutions, each of said impregnation stages being followed by a drying in forced air dried at a temperature not more than 35.degree. C.

Abstract: The data processing system according to the invention has a microprocessor and an external erasable and programmable memory. A logic connection system is arranged between control pins of the microprocessor and a controlled pin of the external memory. These control pins of the microprocessor are the program control pin, a port control pin, the controlled pin of the memory and the memory selection pin. This ligic connection system permits using only one memory both for reading and writing of instructions and/or data instead of the two memories generally used.

Abstract: A network having a series architecture and comprising an electronic master device (M) and a plurality of electronic slave devices (E.sub.1, E.sub.2, . . . ). Each electronic slave device is provided with an associated connection device (30) which enables the electronic slave device to be connected to a common communication channel (2) which interconnects the electronic slave devices and the master device. The common communication channel passes through the connection devices in order to preclude the occurrence of conflicting voltages when one of the electronic slave devices attempts to carry out a transmission to the electronic master device. For this purpose each connection device is equipped with a dedicated-line receiver and a dedicated-line transmitter in cascade, and an open-collector driver connecting the transmission part of the corresponding slave device to the input of the transmitter.

Abstract: A reciprocal authentication system between two groups of electronic units which can be interconnected for the exchange of data.The system periodically supplies a variable access key for the encrypting of confidential exchanges.

Abstract: A space division switching network having a plurality of stages is disclosed for use as part of a time-space-time division switching system. The network employs MOS technology with standard printed circuit boards enabling very compact assembly. To enable a maximum number of stages to be placed on a standard board with appropriate electrical connections to each stage over the standard number of terminals, addresses of crosspoints are supplied in parallel over common address conductors and the appropriate stage is then switched through an enable signal.