Abstract: A substrate processing system with capabilities to detect whether a wafer is dechucked during process is disclosed. An embodiment of the present disclosure's system comprises a reaction chamber provided with an upper electrode and a lower electrode, and configured to process a wafer, a radio frequency generator configured to generate a high frequency power to process the wafer in the reaction chamber, a matching unit disposed between the reaction chamber and the generator and configured to match the generated high frequency power from the generator for use in the reaction chamber, a phase shift detector connected to the reaction chamber in parallel and configured to detect a phase shift between a signal going into the upper electrode and a signal coming out of the lower electrode, and a controller connected to the phase shift detector and configured to receive parameters, to determine and to display the status of the wafer.

Abstract: A plasma modulation apparatus for use in a substrate processing system is disclosed. The apparatus comprising: a plurality of radio frequency (RF) paths connected to N different meshes, wherein a susceptor of the substrate processing system is divided into the N different meshes and N is an integer equal to or greater than 2, wherein each of the RF paths comprises: an RF rod connected to a mesh and configured to transmit RF signal from the meshes; a Voltage-Current (VI) sensor connected to the RF rod and configured to measure a current from the RF rod; and a variable impedance circuit connected to the VI sensor and configured to change an impedance of the RF path and further configured to be grounded, wherein each of the RF paths are grounded separately and each of the RF paths corresponds to a different mesh, respectively.

Abstract: Electrostatic chuck assemblies, systems including the assemblies, and methods of using the electrostatic chuck assemblies and systems are disclosed. Exemplary electrostatic chuck assemblies include a detector or circuit to detect a chucking event, such as insufficient chucking power and/or substrate warpage. Exemplary systems and methods can adjust a chucking power based on the measured or determined chucking event.