Patents by Inventor Sergei JANZEN

Sergei JANZEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for determining a bonding connection in a component arrangement and test apparatus
    Patent number: 9793179
    Abstract: The application relates to a method for determining a bonding connection (1) in a component arrangement (2), wherein the method has the following steps: producing a bonding connection (1) between a bonding section (3) of a bonding wire (4) and a metallic contact point (5), structuring a top-side surface of the bonding wire (4) in the region of the bonding section (3) and determining the bonding connection (1), wherein in this case a test voltage is applied to the bonding wire (4) and the bonding connection (1) so that the bonding connection (1) heats up owing to the current flow, generating a thermogram for the heated bonding connection (1) and determining whether the bonding connection (1) has been produced correctly by evaluating the thermogram. Furthermore, the application relates to a test apparatus for determining a bonding connection (1) in a component arrangement (2).
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: October 17, 2017
    Assignees: Technische Universitat Berlin, Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.
    Inventors: Andreas Middendorf, Torsten Nowak, Sergei Janzen
  • METHOD FOR DETERMINING A BONDING CONNECTION IN A COMPONENT ARRANGEMENT AND TEST APPARATUS
    Publication number: 20170025316
    Abstract: The application relates to a method for determining a bonding connection (1) in a component arrangement (2), wherein the method has the following steps: producing a bonding connection (1) between a bonding section (3) of a bonding wire (4) and a metallic contact point (5), structuring a top-side surface of the bonding wire (4) in the region of the bonding section (3) and determining the bonding connection (1), wherein in this case a test voltage is applied to the bonding wire (4) and the bonding connection (1) so that the bonding connection (1) heats up owing to the current flow, generating a thermogram for the heated bonding connection (1) and determining whether the bonding connection (1) has been produced correctly by evaluating the thermogram. Furthermore, the application relates to a test apparatus for determining a bonding connection (1) in a component arrangement (2).
    Type: Application
    Filed: March 3, 2015
    Publication date: January 26, 2017
    Inventors: Andreas MIDDENDORF, Torsten NOWAK, Sergei JANZEN