Patents by Inventor Sergei Ostapenko

Sergei Ostapenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11506596
    Abstract: An inspection device and method produces a deformation in a panel body and reveals a defect in the panel body. A base and a collar define a chamber. A vacuum device connects with the chamber for evacuating the chamber after the panel body is positioned adjacent to the collar and deflects the panel body into the chamber for propagating the defect in the panel body.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: November 22, 2022
    Assignee: ULTRASONIC TECHNOLOGIES, INC.
    Inventors: Sergei Ostapenko, Chad Rodrigues, Igor Tarasov
  • Patent number: 9933394
    Abstract: A method is disclosed for testing for delamination of a first composite component from a second composite component a composite material. The method comprises coupling a broad-band actuator to the composite material and connecting sweeping frequencies to the broad-band actuator for vibrating the composite material. An acoustic sensor is coupled to the composite material for measuring a resonant frequency curve of the vibrating composite material. The measured resonant frequency curve of the vibrating composite material is compared with a reference resonant frequency curve. A delaminated composite material produces a change in the measured resonant frequency curve relative to the reference resonant frequency curve. The method is suitable for detecting delamination in fuel cells as well as ceramic body armor.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 3, 2018
    Inventor: Sergei Ostapenko
  • Patent number: 8528407
    Abstract: An apparatus and a method are disclosed for testing the quality of a wafer. The apparatus and a method comprise coupling a broad-band actuator to the wafer. Sweeping frequencies are connected to the broad-band actuator for vibrating the wafer. An acoustic sensor is coupled to the wafer for measuring a resonant frequency of the vibrating wafer. The measured resonant frequency of the vibrating wafer is compared with a reference resonant frequency to deterring the quality of the wafer.
    Type: Grant
    Filed: March 8, 2008
    Date of Patent: September 10, 2013
    Inventor: Sergei Ostapenko
  • Publication number: 20130213137
    Abstract: A method is disclosed for testing for delamination of a first composite component from a second composite component a composite material. The method comprises coupling a broad-band actuator to the composite material and connecting sweeping frequencies to the broad-band actuator for vibrating the composite material. An acoustic sensor is coupled to the composite material for measuring a resonant frequency curve of the vibrating composite material. The measured resonant frequency curve of the vibrating composite material is compared with a reference resonant frequency curve. A delaminated composite material produces a change in the measured resonant frequency curve relative to the reference resonant frequency curve. The method is suitable for detecting delamination in fuel cells as well as ceramic body armor.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 22, 2013
    Inventor: Sergei Ostapenko
  • Publication number: 20100138027
    Abstract: A method and apparatus for in-line mechanical quality control of wafers, the method allows for fast detection of cracks including the determination of their size and position on a wafer. The method comprises steps of coupling the wafer and an actuator and exciting a superposition of ultrasonic vibrations in the wafer by sweeping the frequency of the actuator simultaneously around at least two predetermined resonance peaks, recording the resonance frequency, amplitude and bandwidth of resonant frequency curves and comparing that with the resonance frequency, amplitude and bandwidth of reference frequency curves recorded for a mechanically sound crack-free standard wafer. Based on the comparison a reject-accept command is generated using a statistical rejection algorithm.
    Type: Application
    Filed: March 8, 2008
    Publication date: June 3, 2010
    Inventor: Sergei Ostapenko
  • Patent number: 7655479
    Abstract: Luminescent semiconductor quantum dots (QDs) conjugated with biomolecules to serve as sensitive probes for early detection of the cancer cells, specifically for ovarian cancer and lung cancer, which represents the most lethal malignancies. The luminescence characterization of the bin-conjugated QDs with cancer specific antigens using linkage molecules. Photo-enhancement is measured at various laser density power, temperatures and laser wavelengths.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: February 2, 2010
    Assignees: University of South Florida, H. Lee Moffitt Cancer Center and Research Institute, Inc., The Regents of the University of California
    Inventors: Tatyana A. Zhukov, Sergei Ostapenko, Rebecca Sutphen, Johnathan Lancaster, Thomas A. Sellers, Jin Z. Zhang
  • Publication number: 20060003465
    Abstract: Luminescent semiconductor quantum dots (QDs) conjugated with biomolecules to serve as sensitive probes for early detection of the cancer cells, specifically for ovarian cancer and lung cancer, which represents the most lethal malignancies. The luminescence characterization of the bin-conjugated QDs with cancer specific antigens using linkage molecules. Photo-enhancement is measured at various laser density power, temperatures and laser wavelengths.
    Type: Application
    Filed: June 30, 2005
    Publication date: January 5, 2006
    Applicant: UNIVERSITY OF SOUTH FLORIDA
    Inventors: Tatyana Zhukov, Sergei Ostapenko, Rebecca Sutphen, Johnathan Lancaster, Thomas Sellers, Jin Zhang
  • Patent number: 6413789
    Abstract: A method of detecting and monitoring elastic strains in a semiconductor wafer (12) comprising the steps of coupling the wafer (12) to a transducer (10) having a periphery (11). This is followed by operating the transducer (10) to produce ultrasonic vibrations at a predetermined wavelength &lgr; and propagating a standing wave through the wafer (12) in response to the ultrasonic vibrations. The method is characterized by extending the wafer (12) in a cantilevered section L from the periphery (11) of the transducer (10) to a distal end (13), and measuring the amplitude of the standing wave &lgr; in the cantilevered section L. For maximum efficiency, the cantilevered section L is substantially one quarter of the predetermined wavelength (&lgr;/4).
    Type: Grant
    Filed: January 23, 2001
    Date of Patent: July 2, 2002
    Assignee: University of South Florida
    Inventor: Sergei Ostapenko
  • Publication number: 20010046720
    Abstract: A method of detecting and monitoring elastic strains in a semiconductor wafer (12) comprising the steps of coupling the wafer (12) to a transducer (10) having a periphery (11). This is followed by operating the transducer (10) to produce ultrasonic vibrations at a predetermined wavelength &lgr; and propagating a standing wave through the wafer (12) in response to the ultrasonic vibrations. The method is characterized by extending the wafer (12) in a cantilevered section L from the periphery (11) of the transducer (10) to a distal end (13), and measuring the amplitude of the standing wave &lgr; in the cantilevered section L. For maximum efficiency, the cantilevered section L is substantially one quarter of the predetermined wavelength (&lgr;/4).
    Type: Application
    Filed: January 23, 2001
    Publication date: November 29, 2001
    Applicant: University of South Forida
    Inventor: Sergei Ostapenko