Abstract: A method of data nibble-histogram compression can include determining a first amount of space freed by compressing the input data using a first compression technique, determining a second amount of space freed by compressing the input data using a second, different compression technique, compressing the input data using the compression technique of the first and second compression techniques determined to free up more space to create compressed input data, and inserting into the compressed input data, security data including one of a message authentication control (MAC) and an inventory control tag (ICT).

Abstract: Techniques and computing devices for compression memory coloring are described. In one embodiment, for example, an apparatus may include at least one memory, at least on processor, and logic for compression memory coloring, at least a portion of the logic comprised in hardware coupled to the at least one memory and the at least one processor, the logic to determine whether data to be written to memory is compressible, generate a compressed data element responsive to determining data is compressible, the data element comprising a compression indicator, a color, and compressed data, and write the compressed data element to memory. Other embodiments are described and claimed.

Abstract: Apparatus, systems, and/or methods may provide for identifying unencrypted data including a plurality of bits, wherein the unencrypted data may be encrypted and stored in memory. In addition, a determination may be made as to whether the unencrypted data includes a random distribution of the plurality of bits, for example based on a compressibility function. An integrity action may be implemented when the unencrypted data includes a random distribution of the plurality of bits, which may include error correction including a modification to ciphertext of the unencrypted data. Independently of error correction, a diffuser may generate intermediate and final ciphertext. In addition, a key and/or a tweak may be derived for a location in the memory. Moreover, an integrity value may be generated (e.g., as a copy) from a portion of the unencrypted data, and/or stored in a slot of an integrity check line based on the location.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: Methods, apparatus, and system to analyze a memory integrity violation and determine whether its cause was hardware or software based.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: In one example, a system for managing encrypted memory comprises a processor to store a first MAC based on data stored in system memory in response to a write operation to the system memory. The processor can also detect a read operation corresponding to the data stored in the system memory, calculate a second MAC based on the data retrieved from the system memory, determine that the second MAC does not match the first MAC, and recalculate the second MAC with a correction operation, wherein the correction operation comprises an XOR operation based on the data retrieved from the system memory and a replacement value for a device of the system memory. Furthermore, the processor can decrypt the data stored in the system memory in response to detecting the recalculated second MAC matches the first MAC and transmit the decrypted data to cache thereby correcting memory errors.

Abstract: Embodiments of apparatus, method, and storage medium associated with multi-stage memory integrity for securing/protecting memory content are described herein. In some embodiments, an apparatus may include multiple stages having respective encryption engines to encrypt data in response to a write or restore operation; wherein the encryption engines are to successively encrypt the data in a plurality of encryption stages using a plurality of tweaks based on a plurality of selectors of different types {s1, s2, . . . }. In embodiments, the multiple stages may further comprise one or more decryption engines to partially, fully, or pseudo decrypt the plural encrypted data, in response to a read, move or copy operation; wherein the one or more decryption engines are to partially, fully, or pseudo decrypt the plural encrypted data in one or more decryption stages using one or more tweaks based on a subset of the selectors of different types {s1, s2, . . . }.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Abstract: Apparatus, systems, computer readable storage mediums and/or methods may provide memory integrity by using unused physical address bits (or other metadata passed through cache) to manipulate cryptographic memory integrity values, allowing software memory allocation routines to control the assignment of pointers (e.g., implement one or more access control policies). Unused address bits (e.g., because of insufficient external memory) passed through cache, may encode key domain information in the address so that different key domain addresses alias to the same physical memory location. Accordingly, by mixing virtual memory mappings and cache line granularity aliasing, any page in memory may contain a different set of aliases at the cache line level and be non-deterministic to an adversary.

Abstract: A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Abstract: Apparatus, systems, and/or methods may provide for identifying unencrypted data including a plurality of bits, wherein the unencrypted data may be encrypted and stored in memory. In addition, a determination may be made as to whether the unencrypted data includes a random distribution of the plurality of bits, for example based on a compressibility function. An integrity action may be implemented when the unencrypted data includes a random distribution of the plurality of bits, which may include error correction including a modification to ciphertext of the unencrypted data. Independently of error correction, a diffuser may generate intermediate and final ciphertext. In addition, a key and/or a tweak may be derived for a location in the memory. Moreover, an integrity value may be generated (e.g., as a copy) from a portion of the unencrypted data, and/or stored in a slot of an integrity check line based on the location.

Abstract: A design for test (DfT) architecture is provided that enables pre-bond parametric testing of through-silicon vias (TSVs). A grouping of N number of input/output (I/O) segments are configured to receive a test signal in a feedback loop, where each I/O segment includes one or more buffers (or inverters) and a TSV connected at one end to the one or more buffers. The TSV acts as a shunt-connected capacitor—when defect free—and includes a load resistance when the TSV contains a defect. Each I/O segment can also include one or two multiplexers to control whether the I/O segment receives a test or functional signal and, optionally, whether the I/O segment is bypassed or included in the ring oscillator. The varying loads caused by the defects cause variations in the delay across the buffers (or inverters) of an I/O segment that can be detected in the output signal.

Abstract: A design for test (DfT) architecture is provided that enables pre-bond parametric testing of through-silicon vias (TSVs). A grouping of N number of input/output (I/O) segments are configured to receive a test signal in a feedback loop, where each I/O segment includes one or more buffers (or inverters) and a TSV connected at one end to the one or more buffers. The TSV acts as a shunt-connected capacitor—when defect free—and includes a load resistance when the TSV contains a defect. Each I/O segment can also include one or two multiplexers to control whether the I/O segment receives a test or functional signal and, optionally, whether the I/O segment is bypassed or included in the ring oscillator. The varying loads caused by the defects cause variations in the delay across the buffers (or inverters) of an I/O segment that can be detected in the output signal.

Abstract: A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: A method is provided to test a modular integrated circuit (IC) comprising: testing a module-under-test (MUT) within the IC while causing a controlled toggle rate within a first neighbor module of the MUT; wherein the controlled toggle rate within the first neighbor module is selected so that toggling within the first neighbor module has substantially the same effect upon operation of the MUT that operation of the first neighbor module would have during actual normal functional operation of the first neighbor module.

Abstract: A design for test (DfT) architecture is provided that enables pre-bond parametric testing of through-silicon vias (TSVs). A grouping of N number of input/output (I/O) segments are configured to receive a test signal in a feedback loop, where each I/O segment includes one or more buffers (or inverters) and a TSV connected at one end to the one or more buffers. The TSV acts as a shunt-connected capacitor—when defect free—and includes a load resistance when the TSV contains a defect. Each I/O segment can also include one or two multiplexers to control whether the I/O segment receives a test or functional signal and, optionally, whether the I/O segment is bypassed or included in the ring oscillator. The varying loads caused by the defects cause variations in the delay across the buffers (or inverters) of an I/O segment that can be detected in the output signal.

Abstract: A method is provided to test a modular integrated circuit (IC) comprising: testing a module-under-test (MUT) within the IC while causing a controlled toggle rate within a first neighbor module of the MUT; wherein the controlled toggle rate within the first neighbor module is selected so that toggling within the first neighbor module has substantially the same effect upon operation of the MUT that operation of the first neighbor module would have during actual normal functional operation of the first neighbor module.