Patents by Inventor Sergej Scherer

Sergej Scherer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Frame elements for package structures comprising printed circuit boards (PCBs)
    Patent number: 10129972
    Abstract: An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: November 13, 2018
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Martin Fritz, Bernhard Gebauer, Lueder Elbrecht, Martin Handtmann, Oliver Wiedenmann, Sergej Scherer
  • FRAME ELEMENTS FOR PACKAGE STRUCTURES COMPRISING PRINTED CIRCUIT BOARDS (PCBs)
    Publication number: 20170127523
    Abstract: An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.
    Type: Application
    Filed: October 30, 2015
    Publication date: May 4, 2017
    Inventors: Martin Fritz, Bernhard Gebauer, Lueder Elbrecht, Martin Handtmann, Oliver Wiedenmann, Sergej Scherer