Abstract: A face frame including features for coupling the surgical garment to a surgical helmet. The face frame (524) comprises a lower beam (528) connected by a pair of posts (526, 527). The posts of the face frame comprise a face frame coupler (552, 554) configured to removably couple the face frame to a surgical helmet.

Abstract: This invention relates to multi-purpose probe-based apparatus, and to methods for providing images of surface topography, and detection and quantitative mapping of local mechanical and electromagnetic properties in non-resonant oscillatory mode. These methods may include filtering of incoming probe signals. These incoming probe signals provide time deflection curves, parts of which are used for the control of scanning and collection of data that reflects sample adhesion, stiffness, elastic modulus and viscoelastic response, electric and magnetic interactions. These methods permit adaptive choice of an AFM's deflection set-point, which allows imaging at the contact repulsive force for precise surface profilometry, as non-resonant oscillation brings tip and sample into intermittent contact. These methods permit choosing a desired deformation model that allows an extraction of quantitative mechanical properties including viscoelastic response from deflection curves.

Abstract: A method of operating a scanning probe microscope (SPM) includes scanning a sample as a probe of the SPM interacts with a sample, and collecting sample surface data in response to the scanning step. The method identifies a feature of the sample from the sample surface data and automatically performs a zoom-in scan of the feature based on the identifying step. The method operates to quickly identify and confirm the location of features of interest, such as nano-asperities, so as to facilitate performing a directed high resolution image of the feature.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: Described are autofocusing algorithms and system implementations for machine inspection applications. The disclosed algorithms depend neither on the type of image (visual, infrared, spectrometric, scanning, etc.) nor on the type of image detector. Disclosed image filtering techniques, image focus measure functions and adaptive velocity control methods can be used in computer-based inspection systems for many different types of cameras and detectors as well as for a variety of magnification levels. The proposed autofocusing system can utilize the existing imaging hardware of the inspection system and does not require any additional components.

Abstract: A method of operating a scanning probe microscope (SPM) includes scanning a sample as a probe of the SPM interacts with a sample, and collecting sample surface data in response to the scanning step. The method identifies a feature of the sample from the sample surface data and automatically performs a zoom-in scan of the feature based on the identifying step. The method operates to quickly identify and confirm the location of features of interest, such as nano-asperities, so as to facilitate performing a directed high resolution image of the feature.

Abstract: The present invention generally includes a display device having a plurality of indicia indicative of a vehicle parameter. The display device includes a plurality of dimmable segments. Each dimmable segment has a lower end point associated with a first value of the vehicle parameter and an upper end point associated with a second value of the vehicle parameter. Each of the dimmable segments has an independently adjustable intensity and adapted to illuminate at least a portion of the indicia. A control module is adapted to receive a signal indicative of an actual value of the vehicle parameter. The control module also adjusts the intensity of at least one of the dimmable segments based on the signal.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone-radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20.

Abstract: A method and system for detecting electrical short circuit defects in a plate structure of a flat panel display, for example, a field emission display (FED) is disclosed. In one embodiment, the process first applies a stimulation to the electrical conductors of the plate structure. Next, the process creates an infra-red thermal mapping of a cathode region of the FED. For example, an infra-red array may be used to snap a picture of the cathode of the FED. Then, the process analyzes the infra-red thermal mapping to determine a region of the FED which contains the electrical short circuit defect. Another embodiment localizes the defect to one sub-pixel by performing an infra-red mapping of the region which the previous IR mapping process determined to contain the electrical short circuit defect. Then, the process analyzes this infra-red mapping to determine a sub-pixel of the FED which contains the electrical short circuit defect.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: A method and system for detecting electrical short circuit defects in a plate structure of a flat panel display, for example, a field emission display (FED). In one embodiment, the process first applies a stimulation to the electrical conductors of the plate structure. Next, the process creates an infra-red thermal mapping of a cathode region the FED. For example, an infra-red array may be used to snap a picture of the cathode of the FED. Then, the process analyzes the infra-red thermal mapping to determine a region of the FED which contains the electrical short circuit defect. Another embodiment localizes the defect to one sub-pixel by performing an infra-red mapping of the region which the previous IR mapping process determined to contain the electrical short circuit defect. Then, the process analyzes this infra-red mapping to determine a sub-pixel of the FED which contains the electrical short circuit defect.

Abstract: An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20.