Patents by Inventor Sergio CHAN ARGUEDAS
Sergio CHAN ARGUEDAS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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First-level integration of second-level thermal interface material for integrated circuit assemblies
Patent number: 11881438Abstract: A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.Type: GrantFiled: January 17, 2020Date of Patent: January 23, 2024Assignee: Intel CorporationInventors: Elah Bozorg-Grayeli, Kyle Arrington, Sergio Chan Arguedas, Aravindha Antoniswamy -
Patent number: 11832419Abstract: Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.Type: GrantFiled: December 20, 2019Date of Patent: November 28, 2023Assignee: Intel CorporationInventors: Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann, Edvin Cetegen, Ravindranath V. Mahajan, Robert L. Sankman, Ken P. Hackenberg, Sergio A. Chan Arguedas
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Publication number: 20230343723Abstract: Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Inventors: Nicholas NEAL, Nicholas S. HAEHN, Sergio CHAN ARGUEDAS, Edvin CETEGEN, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON
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Patent number: 11776869Abstract: A device package and a method of forming a device package are described. The device package has dies disposed on a substrate, and one or more layers with a high thermal conductivity, referred to as the highly-conductive (HC) intermediate layers, disposed on the dies on the substrate. The device package further includes a lid with legs on an outer periphery of the lid, a top surface, and a bottom surface. The legs of the lid are attached to the substrate with a sealant. The bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate. The device package may also include thermal interface materials (TIMs) disposed on the HC intermediate layers. The TIMs may be disposed between the bottom surface of the lid and one or more top surfaces of the HC intermediate layers.Type: GrantFiled: April 11, 2022Date of Patent: October 3, 2023Assignee: Intel CorporationInventors: Feras Eid, Johanna M. Swan, Sergio Chan Arguedas, John J. Beatty
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Patent number: 11776864Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality of pads, and a plurality of bumps, where each bump is over a different one of the plurality of pads. In an embodiment, the electronic package further comprises a guard feature adjacent to the FLI bump region. In an embodiment, the guard feature comprises, a guard pad, and a guard bump over the guard pad, wherein the guard feature is electrically isolated from circuitry of the electronic package.Type: GrantFiled: July 15, 2019Date of Patent: October 3, 2023Assignee: Intel CorporationInventors: Jacob Vehonsky, Nicholas S. Haehn, Thomas Heaton, Steve S. Cho, Rahul Jain, Tarek Ibrahim, Antariksh Rao Pratap Singh, Edvin Cetegen, Nicholas Neal, Sergio Chan Arguedas
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Publication number: 20220256715Abstract: Embodiments of the invention include a mmWave transceiver and methods of forming such devices. In an embodiment, the mmWave transceiver includes an RF module. The RF module may include a package substrate, a plurality of antennas formed on the package substrate, and a die attached to a surface of the package substrate. In an embodiment, the mmWave transceiver may also include a mainboard mounted to the RF module with one or more solder balls. In an embodiment, a thermal feature is embedded within the mainboard, and the thermal feature is separated from the die by a thermal interface material (TIM) layer. According to an embodiment, the thermal features are slugs and/or vias. In an embodiment, the die compresses the TIM layer resulting in a TIM layer with minimal thickness.Type: ApplicationFiled: July 30, 2021Publication date: August 11, 2022Inventors: Divya MANI, William J. LAMBERT, Shawna LIFF, Sergio A. CHAN ARGUEDAS, Robert L. SANKMAN
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Publication number: 20220238411Abstract: A device package and a method of forming a device package are described. The device package has dies disposed on a substrate, and one or more layers with a high thermal conductivity, referred to as the highly-conductive (HC) intermediate layers, disposed on the dies on the substrate. The device package further includes a lid with legs on an outer periphery of the lid, a top surface, and a bottom surface. The legs of the lid are attached to the substrate with a sealant. The bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate. The device package may also include thermal interface materials (TIMs) disposed on the HC intermediate layers. The TIMs may be disposed between the bottom surface of the lid and one or more top surfaces of the HC intermediate layers.Type: ApplicationFiled: April 11, 2022Publication date: July 28, 2022Inventors: Feras EID, Johanna M. SWAN, Sergio CHAN ARGUEDAS, John J. BEATTY
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Patent number: 11328978Abstract: A device package and a method of forming a device package are described. The device package has dies disposed on a substrate, and one or more layers with a high thermal conductivity, referred to as the highly-conductive (HC) intermediate layers, disposed on the dies on the substrate. The device package further includes a lid with legs on an outer periphery of the lid, a top surface, and a bottom surface. The legs of the lid are attached to the substrate with a sealant. The bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate. The device package may also include thermal interface materials (TIMs) disposed on the HC intermediate layers. The TIMs may be disposed between the bottom surface of the lid and one or more top surfaces of the HC intermediate layers.Type: GrantFiled: September 30, 2017Date of Patent: May 10, 2022Assignee: Intel CorporationInventors: Feras Eid, Johanna M. Swan, Sergio Chan Arguedas, John J. Beatty
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Patent number: 11328979Abstract: A device package and a method of forming a device package are described. The device package includes a plurality of posts disposed on a substrate. Each post has a top surface and a bottom surface that is opposite from the top surface. The device package also has one or more dies disposed on the substrate. The dies are adjacent to the plurality of posts on the substrate. The device package further includes a lid disposed above the plurality of posts and the one or more dies on the substrate. The lid has a top surface and a bottom surface that is opposite from the top surface. Lastly, an adhesive layer attaches the top surfaces of the plurality of posts and the bottom surface of the lid. The device package may also include one or more thermal interface materials (TIMs) disposed on the dies.Type: GrantFiled: September 30, 2017Date of Patent: May 10, 2022Assignee: Intel CorporationInventors: Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Chan Arguedas, Johanna M. Swan, John J. Beatty
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Patent number: 11112841Abstract: Embodiments of the invention include a mmWave transceiver and methods of forming such devices. In an embodiment, the mmWave transceiver includes an RF module. The RF module may include a package substrate, a plurality of antennas formed on the package substrate, and a die attached to a surface of the package substrate. In an embodiment, the mmWave transceiver may also include a mainboard mounted to the RF module with one or more solder balls. In an embodiment, a thermal feature is embedded within the mainboard, and the thermal feature is separated from the die by a thermal interface material (TIM) layer. According to an embodiment, the thermal features are slugs and/or vias. In an embodiment, the die compresses the TIM layer resulting in a TIM layer with minimal thickness.Type: GrantFiled: April 1, 2017Date of Patent: September 7, 2021Assignee: Intel CorporationInventors: Divya Mani, William J. Lambert, Shawna Liff, Sergio A. Chan Arguedas, Robert L. Sankman
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FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT ASSEMBLIES
Publication number: 20210225729Abstract: A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.Type: ApplicationFiled: January 17, 2020Publication date: July 22, 2021Applicant: Intel CorporationInventors: Elah Bozorg-Grayeli, Kyle Arrington, Sergio Chan Arguedas, Aravindha Antoniswamy -
Publication number: 20210195798Abstract: Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.Type: ApplicationFiled: December 20, 2019Publication date: June 24, 2021Inventors: Nicholas NEAL, Nicholas S. HAEHN, Je-Young CHANG, Kyle ARRINGTON, Aaron MCCANN, Edvin CETEGEN, Ravindranath V. MAHAJAN, Robert L. SANKMAN, Ken P. HACKENBERG, Sergio A. CHAN ARGUEDAS
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Patent number: 11004768Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.Type: GrantFiled: August 1, 2019Date of Patent: May 11, 2021Assignee: Intel CorporationInventors: Muhammad S. Islam, Enisa Harris, Suzana Prstic, Sergio Chan Arguedas, Sachin Deshmukh, Aravindha Antoniswamy, Elah Bozorg-Grayeli
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Publication number: 20210066162Abstract: A device is disclosed. The device includes a substrate, a die on the substrate, a thermal interface material (TIM) on the die, and solder bumps on a periphery of a top surface of the substrate. An integrated heat spreader (IHS) is formed on the solder bumps. The IHS covers the TIM.Type: ApplicationFiled: August 30, 2019Publication date: March 4, 2021Inventors: Sergio A. CHAN ARGUEDAS, Nicholas S. HAEHN, Edvin CETEGEN, Nicholas NEAL, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON, Vipul MEHTA
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Publication number: 20210035886Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.Type: ApplicationFiled: August 1, 2019Publication date: February 4, 2021Applicant: Intel CorporationInventors: Muhammad S. Islam, Enisa Harris, Suzana Prstic, Sergio Chan Arguedas, Sachin Deshmukh, Aravindha Antoniswamy, Elah Bozorg-Grayeli
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Publication number: 20210035921Abstract: Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.Type: ApplicationFiled: July 30, 2019Publication date: February 4, 2021Inventors: Nicholas NEAL, Nicholas S. HAEHN, Sergio CHAN ARGUEDAS, Edvin CETEGEN, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON
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Publication number: 20210020531Abstract: Embodiments disclosed herein include electronic packages with underfill flow control features. In an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. In an embodiment, a die is coupled to the package substrate by the plurality of interconnects and a flow control feature is adjacent on the package substrate. In an embodiment, the flow control feature is electrically isolated from circuitry of the electronic package. In an embodiment, the electronic package further comprises an underfill surrounding the plurality of interconnects and in contact with the flow control feature.Type: ApplicationFiled: July 15, 2019Publication date: January 21, 2021Inventors: Edvin CETEGEN, Jacob VEHONSKY, Nicholas S. HAEHN, Thomas HEATON, Steve S. CHO, Rahul JAIN, Tarek IBRAHIM, Antariksh Rao Pratap SINGH, Nicholas NEAL, Sergio CHAN ARGUEDAS, Vipul MEHTA
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Publication number: 20210020532Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality of pads, and a plurality of bumps, where each bump is over a different one of the plurality of pads. In an embodiment, the electronic package further comprises a guard feature adjacent to the FLI bump region. In an embodiment, the guard feature comprises, a guard pad, and a guard bump over the guard pad, wherein the guard feature is electrically isolated from circuitry of the electronic package.Type: ApplicationFiled: July 15, 2019Publication date: January 21, 2021Inventors: Jacob VEHONSKY, Nicholas S. HAEHN, Thomas HEATON, Steve S. CHO, Rahul JAIN, Tarek IBRAHIM, Antariksh Rao Pratap SINGH, Edvin CETEGEN, Nicholas NEAL, Sergio CHAN ARGUEDAS
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Publication number: 20200227335Abstract: A device package and a method of forming a device package are described. The device package has dies disposed on a substrate, and one or more layers with a high thermal conductivity, referred to as the highly-conductive (HC) intermediate layers, disposed on the dies on the substrate. The device package further includes a lid with legs on an outer periphery of the lid, a top surface, and a bottom surface. The legs of the lid are attached to the substrate with a sealant. The bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate. The device package may also include thermal interface materials (TIMs) disposed on the HC intermediate layers. The TIMs may be disposed between the bottom surface of the lid and one or more top surfaces of the HC intermediate layers.Type: ApplicationFiled: September 30, 2017Publication date: July 16, 2020Inventors: Feras EID, Johanna M. SWAN, Sergio CHAN ARGUEDAS, John J. BEATTY
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Publication number: 20200194335Abstract: A device package and a method of forming a device package are described. The device package includes a plurality of posts disposed on a substrate. Each post has a top surface and a bottom surface that is opposite from the top surface. The device package also has one or more dies disposed on the substrate. The dies are adjacent to the plurality of posts on the substrate. The device package further includes a lid disposed above the plurality of posts and the one or more dies on the substrate. The lid has a top surface and a bottom surface that is opposite from the top surface. Lastly, an adhesive layer attaches the top surfaces of the plurality of posts and the bottom surface of the lid. The device package may also include one or more thermal interface materials (TIMs) disposed on the dies.Type: ApplicationFiled: September 30, 2017Publication date: June 18, 2020Inventors: Feras EID, Dinesh PADMANABHAN RAMALEKSHMI THANU, Sergio CHAN ARGUEDAS, Johanna M. SWAN, John J. BEATTY