Abstract: In one example, an apparatus being part of a Light Detection and Ranging (LiDAR) module is provided. The apparatus comprises a microelectromechanical system (MEMS) and a substrate. The MEMS comprising an array of micro-mirror assemblies, each micro-mirror assembly comprises: a first flexible support structure and a second flexible support structure connected to the substrate; a micro-mirror comprising a first connection structure and a second connection structure, the first connection structure being connected to the first flexible support structure at a first connection point, the second connection structure being connected to the second flexible support structure at a second connection point, the first and second connection points being aligned with a rotation axis around which the micro-mirror rotates, the first flexible support structure and the second flexible support structure being configured to allow the first and second connection points to move when the micro-mirror rotates.

Abstract: According to certain embodiments, a micro-electromechanical system (MEMS) apparatus has a MEMS mirror structure with a rotatable mirror. Rotation of the mirror produces a change in a measured capacitance corresponding to an angle of rotation. The MEMS structure sits on an oxide layer deposited on a substrate. There is a parasitic capacitance between the MEMS mirror structure and the substrate. An added capacitance is provided between the substrate and a DC voltage source. The added capacitance is much larger than the parasitic capacitance, and shunts the parasitic capacitance to ground to minimize its effect on the measured capacitance.

Abstract: In one example, a semiconductor integrated circuit is provided. The semiconductor integrated circuit includes a microelectromechanical system (MEMS), a substrate on which the MEMS is formed, and a controller, the MEMS including one or more micro-mirror assemblies, each micro-mirror assembly including: a micro-mirror comprising a first connection structure and a second connection structure, the first connection structure being connected to the substrate at a first pivot point, the second connection structure being connected to the substrate at a second pivot point; an actuator configured to rotate the micro-mirror; and a measurement circuit configured to measure an electrical resistance of at least one of the first connection structure or the second connection structure. The controller is configured to control the actuator of each of the one or more micro-mirror assemblies based on the electrical resistance measurements from the measurement circuits.

Abstract: Embodiments of the disclosure include a method of scanning mirror assembly for an optical sensing system. The method may include bonding a first wafer that includes a handle to a second wafer that includes a scanning mirror layer and etching the first wafer to release the handle. The method may further include bonding a third wafer that includes an actuator layer to the second wafer, and etching the third wafer to form a first set of actuator features and a second set of actuator features from the actuator layer. The method may also include etching the second wafer to release the scanning mirror layer.

Abstract: Embodiments of the disclosure include a scanning mirror assembly for an optical sensing system. The scanning mirror assembly may include a scanning mirror formed in a first layer of the scanning mirror assembly. The scanning mirror assembly may also include a MEMS actuator formed in a second layer of the scanning mirror assembly, where the first layer is a predetermined distance above the second layer. The MEMS actuator may also include a plurality of stator actuator features and a plurality of rotatable actuator features formed from a same semiconductor layer during a fabrication process.

Abstract: Embodiments of the disclosure include a scanning mirror assembly for an optical sensing system. The scanning mirror assembly may include a scanning mirror formed in a first layer of the scanning mirror assembly. The scanning mirror assembly may also include a MEMS actuator formed in a second layer of the scanning mirror assembly, where the first layer is a predetermined distance above the second layer. The MEMS actuator may also include a plurality of stator actuator features and a plurality of rotatable actuator features formed from a same semiconductor layer during a fabrication process.

Abstract: In one example, a light detection and ranging (LiDAR) module is provided. The LiDAR module includes a microelectromechanical system (MEMS), a substrate on which the MEMS is formed, and one or more measurement circuits. The MEMS includes an array of micro-mirror assemblies. One or more micro-mirror assemblies of the array of micro-mirror assemblies further includes a measurement structure connected to the micro-mirror, an electrical resistance of the measurement structure being variable based on a rotation angle of the micro-mirror. The one or more measurement circuits are configured to: determine the electrical resistance of the measurement structure of the one or more micro-mirror assemblies; and provide the determined electrical resistance to enable measurement of a rotation angle of the micro-mirror of the one or more micro-mirror assemblies.

Abstract: In one example, a semiconductor integrated circuit is provided. The semiconductor integrated circuit includes a microelectromechanical system (MEMS), a substrate on which the MEMS is formed, and a controller, the MEMS including one or more micro-mirror assemblies, each micro-mirror assembly including: a micro-mirror comprising a first connection structure and a second connection structure, the first connection structure being connected to the substrate at a first pivot point, the second connection structure being connected to the substrate at a second pivot point; an actuator configured to rotate the micro-mirror; and a measurement circuit configured to measure an electrical resistance of at least one of the first connection structure or the second connection structure. The controller is configured to control the actuator of each of the one or more micro-mirror assemblies based on the electrical resistance measurements from the measurement circuits.

Abstract: According to certain embodiments, a micro-electromechanical system (MEMS) apparatus has a MEMS mirror structure with a rotatable mirror. Rotation of the mirror produces a change in a measured capacitance corresponding to an angle of rotation. The MEMS structure sits on an oxide layer deposited on a substrate. There is a parasitic capacitance between the MEMS mirror structure and the substrate. An added capacitance is provided between the substrate and a DC voltage source. The added capacitance is much larger than the parasitic capacitance, and shunts the parasitic capacitance to ground to minimize its effect on the measured capacitance.

Abstract: In one example, an apparatus being part of a Light Detection and Ranging (LiDAR) module is provided. The apparatus comprises a microelectromechanical system (MEMS) and a substrate. The MEMS comprising an array of micro-mirror assemblies, each micro-mirror assembly comprises: a first flexible support structure and a second flexible support structure connected to the substrate; a micro-mirror comprising a first connection structure and a second connection structure, the first connection structure being connected to the first flexible support structure at a first connection point, the second connection structure being connected to the second flexible support structure at a second connection point, the first and second connection points being aligned with a rotation axis around which the micro-mirror rotates, the first flexible support structure and the second flexible support structure being configured to allow the first and second connection points to move when the micro-mirror rotates.

Abstract: Embodiments of the disclosure provide a micromachined mirror assembly for controlling directions of optical signals in an optical sensing system. The micromachined mirror assembly includes a micro mirror and at least one piezoelectric actuator. The micro mirror is suspended over a substrate by at least one beam mechanically coupled to the micro mirror, and the at least one piezoelectric actuator is mechanically coupled to the at least one beam and is configured to drive the micro mirror via the at least one beam. The at least one piezoelectric actuator is configured to drive the micro mirror to tilt around a first axis based on a first electrical signal applied to the at least one piezoelectric actuator. The first electrical signal causes a piezoelectric material of the at least one piezoelectric actuator to expand in a first direction in parallel with the first axis.

Abstract: A MEMS apparatus with dynamic displacement control includes a MEMS parallel plate capacitor integrated with one or more memristors in a series configuration wherein a displacement is observable as a function of memristance, such that an upper electrode position is capable of being interpreted in a form of a resistance rather than a capacitance. The current is limited by said MEMS parallel plate capacitor restricting a change in the resistance of the memristor(s). The memristor(s) can be employed in some embodiments a sensor element to improve a MEMS operation range.

Abstract: A MEMS apparatus with dynamic displacement control includes a MEMS parallel plate capacitor integrated with one or more memristors in a series configuration wherein a displacement is observable as a function of memristance, such that an upper electrode position is capable of being interpreted in a form of a resistance rather than a capacitance. The current is limited by said MEMS parallel plate capacitor restricting a change in the resistance of the memristor(s). The memristor(s) can be employed in some embodiments a sensor element to improve a MEMS operation range.