Patents by Inventor Sergio Fissore

Sergio Fissore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7187551
    Abstract: A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: March 6, 2007
    Assignee: International Rectifier Corporation
    Inventors: Sergio Fissore, William Grant
  • Patent number: 6933593
    Abstract: A power module that includes a molded shell having a lead frame molded in a mold body, and a plurality of power semiconductor devices disposed directly on the die pads of the lead frame.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: August 23, 2005
    Assignee: International Rectifier Corporation
    Inventors: Sergio Fissore, William Grant
  • Patent number: 6912134
    Abstract: A dual output power module housing a dual output power circuit for providing variable power to two parallel connected fan motors is shown. The power module includes a pad which has disposed thereon two power switching devices, two intelligent power switches, and a power circuit board on which circuits for controlling the intelligent power switches are disposed. The module includes a power shell that surrounds the dual output power circuit, and a resilient, flexible enclosure which encapsulates the power shell and the circuit components within the power shell.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: June 28, 2005
    Assignee: International Rectifier Corporation
    Inventors: William R. Grant, Sergio Fissore
  • Publication number: 20050068735
    Abstract: A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.
    Type: Application
    Filed: August 12, 2004
    Publication date: March 31, 2005
    Inventors: Sergio Fissore, William Grant
  • Publication number: 20050035434
    Abstract: A power module that includes a molded shell having a lead frame molded in a mold body, and a plurality of power semiconductor devices disposed directly on the die pads of the lead frame.
    Type: Application
    Filed: August 13, 2004
    Publication date: February 17, 2005
    Inventors: Sergio Fissore, William Grant
  • Publication number: 20020030977
    Abstract: A dual output power module housing a dual output power circuit for providing variable power to two parallel connected fan motors is shown. The power module includes a pad which has disposed thereon two power switching devices, two intelligent power switches, and a power circuit board on which circuits for controlling the intelligent power switches are disposed. The module includes a power shell that surrounds the dual output power circuit, and a resilient, flexible enclosure which encapsulates the power shell and the circuit components within the power shell.
    Type: Application
    Filed: September 12, 2001
    Publication date: March 14, 2002
    Inventors: William R. Grant, Sergio Fissore
  • Patent number: D456772
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: May 7, 2002
    Assignee: International Rectifier Corporation
    Inventors: William Grant, Sergio Fissore