Patents by Inventor Sergio Joaquin GONZALEZ FLORES

Sergio Joaquin GONZALEZ FLORES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods related to shielded module having compression overmold
    Patent number: 11063002
    Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.
    Type: Grant
    Filed: January 5, 2020
    Date of Patent: July 13, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
  • METHODS RELATED TO SHIELDED MODULE HAVING COMPRESSION OVERMOLD
    Publication number: 20200258845
    Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.
    Type: Application
    Filed: January 5, 2020
    Publication date: August 13, 2020
    Inventors: Hoang Mong NGUYEN, Luis Eduardo HERRERA, Sergio Joaquin GONZALEZ FLORES, Matthew Sean READ, Anthony James LOBIANCO, Heliodoro OSUNA
  • Shielded module having compression overmold
    Patent number: 10529669
    Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.
    Type: Grant
    Filed: July 7, 2018
    Date of Patent: January 7, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
  • Shielded module having compression overmold
    Patent number: 10290585
    Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: May 14, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
  • SHIELDED MODULE HAVING COMPRESSION OVERMOLD
    Publication number: 20180315717
    Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.
    Type: Application
    Filed: July 7, 2018
    Publication date: November 1, 2018
    Inventors: Hoang Mong NGUYEN, Luis Eduardo HERRERA, Sergio Joaquin GONZALEZ FLORES, Matthew Sean READ, Anthony James LOBIANCO, Heliodoro OSUNA
  • SHIELDED MODULE HAVING COMPRESSION OVERMOLD
    Publication number: 20170025362
    Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.
    Type: Application
    Filed: May 26, 2016
    Publication date: January 26, 2017
    Inventors: Hoang Mong NGUYEN, Luis Eduardo HERRERA, Sergio Joaquin GONZALEZ FLORES, Matthew Sean READ, Anthony James LOBIANCO, Heliodoro OSUNA