Patents by Inventor Sergio Shoji
Sergio Shoji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10468233Abstract: Methods of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power are provided herein. In some embodiments, a method of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power includes providing a first pulsed RF power waveform to a process chamber at a first power level during a first time period, providing a second pulsed RF power waveform at a first power level to the process chamber during the first time period, obtaining a first reflected power created by the first and second pulsed RF power waveforms provided during the first time period, and performing a first load leveling process to adjust the first power level of the first pulsed RF power waveform to compensate for the obtained reflected power during the first time period to produce a delivered power at a preset power level.Type: GrantFiled: August 29, 2017Date of Patent: November 5, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Katsumasa Kawasaki, Justin Phi, Sergio Shoji
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Publication number: 20170358428Abstract: Methods of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power are provided herein. In some embodiments, a method of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power includes providing a first pulsed RF power waveform to a process chamber at a first power level during a first time period, providing a second pulsed RF power waveform at a first power level to the process chamber during the first time period, obtaining a first reflected power created by the first and second pulsed RF power waveforms provided during the first time period, and performing a first load leveling process to adjust the first power level of the first pulsed RF power waveform to compensate for the obtained reflected power during the first time period to produce a delivered power at a preset power level.Type: ApplicationFiled: August 29, 2017Publication date: December 14, 2017Inventors: Katsumasa KAWASAKI, Justin PHI, Sergio SHOJI
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Patent number: 9741539Abstract: Methods of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power are provided herein. In some embodiments, a method of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power includes providing a first pulsed RF power waveform to a process chamber at a first power level during a first time period, providing a second pulsed RF power waveform at a first power level to the process chamber during the first time period, obtaining a first reflected power created by the first and second pulsed RF power waveforms provided during the first time period, and performing a first load leveling process to adjust the first power level of the first pulsed RF power waveform to compensate for the obtained reflected power during the first time period to produce a delivered power at a preset power level.Type: GrantFiled: October 19, 2015Date of Patent: August 22, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Katsumasa Kawasaki, Justin Phi, Sergio Shoji
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Patent number: 9639097Abstract: Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.Type: GrantFiled: September 25, 2014Date of Patent: May 2, 2017Assignee: Applied Materials, Inc.Inventors: Chetan Mahadeswaraswamy, Kartik Ramaswamy, Bryan Liao, Sergio Shoji, Duy D. Nguyen, Hamid Noorbakhsh, David Palagashvili
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Publication number: 20170098527Abstract: Methods of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power are provided herein. In some embodiments, a method of operating a plasma enhanced substrate processing system using pulsed radio frequency (RF) power includes providing a first pulsed RF power waveform to a process chamber at a first power level during a first time period, providing a second pulsed RF power waveform at a first power level to the process chamber during the first time period, obtaining a first reflected power created by the first and second pulsed RF power waveforms provided during the first time period, and performing a first load leveling process to adjust the first power level of the first pulsed RF power waveform to compensate for the obtained reflected power during the first time period to produce a delivered power at a preset power level.Type: ApplicationFiled: October 19, 2015Publication date: April 6, 2017Inventors: Katsumasa KAWASAKI, Justin PHI, Sergio SHOJI
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Publication number: 20150134128Abstract: Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.Type: ApplicationFiled: September 25, 2014Publication date: May 14, 2015Inventors: Chetan MAHADESWARASWAMY, Kartik RAMASWAMY, Bryan LlAO, Sergio SHOJI, Duy D. NGUYEN, Hamid NOORBAKHSH, David PALAGASHVILI
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Patent number: 8880227Abstract: Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.Type: GrantFiled: March 3, 2011Date of Patent: November 4, 2014Assignee: Applied Materials, Inc.Inventors: Chetan Mahadeswaraswamy, Kartik Ramaswamy, Bryan Liao, Sergio Shoji, Duy D. Nguyen, Hamid Noorbakhsh, David Palagashvili
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Publication number: 20120048467Abstract: Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.Type: ApplicationFiled: March 3, 2011Publication date: March 1, 2012Applicant: Applied Materials, Inc.Inventors: Chetan Mahadeswaraswamy, Kartik Ramaswamy, Bryan Liao, Sergio Shoji, Duy D. Nguyen, Hamid Noorbakhsh, David Palagashvili
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Patent number: 5721737Abstract: A serial transmission system for controlling a network of input/output devices is provided. The serial transmission system includes: a three wire serial link; a master unit for controlling communication over the serial link; multiple input remote units for receiving information from the input devices; and multiple output remote units for controlling the output devices. The master unit includes a programmable optically isolated microcontroller adapted to initiate a synchronous data link control (SDLC) communications protocol with the remote units. In addition the master unit includes memory tables for storing input/output, error, diagnostic, status and node availability information. This information can be shared with a PC or host controller. In addition, the PC or host controller can include programs for directing the master unit and remote units to initialize, reset, scan, or maintain an idle condition.Type: GrantFiled: May 9, 1995Date of Patent: February 24, 1998Assignee: SMC Pneumatics, Inc.Inventors: Bahman Radjabi, Sergio Shoji, Mary Nagata