Patents by Inventor Sergio V. Martinez

Sergio V. Martinez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
    Publication number: 20210197325
    Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.
    Type: Application
    Filed: March 12, 2021
    Publication date: July 1, 2021
    Inventors: Sergio V. Martinez, Jeffrey R. Ogorzalek, Patrick J. Lott
  • Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies
    Patent number: 11033990
    Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 15, 2021
    Assignee: RAYTHEON COMPANY
    Inventors: Sergio V. Martinez, Jeffrey R. Ogorzalek, Patrick J. Lott
  • LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
    Publication number: 20200171609
    Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 4, 2020
    Inventors: Sergio V. Martinez, Jeffrey R. Ogorzalek, Patrick J. Lott
  • System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
    Patent number: 7598119
    Abstract: System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: October 6, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Sergio V. Martinez, Boon Hor Lee, Karen Lynne Robinson
  • System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
    Publication number: 20080225491
    Abstract: System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 18, 2008
    Inventors: Sergio V. Martinez, Boon Hor Lee, Karen Lynne Robinson