Abstract: A method operational on a transmitter device is provided for projecting a composite code mask. A composite code mask on a tangible medium is obtained, where the composite code mask includes a code layer combined with a carrier layer. The code layer may include uniquely identifiable spatially-coded codewords defined by a plurality of symbols. The carrier layer may be independently ascertainable and distinct from the code layer and includes a plurality of reference objects that are robust to distortion upon projection. At least one of the code layer and carrier layer may be pre-shaped by a synthetic point spread function prior to projection. At least a portion of the composite code mask is projected, by the transmitter device, onto a target object to help a receiver ascertain depth information for the target object with a single projection of the composite code mask.

Abstract: A method operational on a receiver device for decoding a codeword is provided. At least a portion of a composite code mask is obtained, via a receiver sensor, and projected on the surface of a target object. The composite code mask may be defined by a code layer and a carrier layer. A code layer of uniquely identifiable spatially-coded codewords may be defined by a plurality of symbols. A carrier layer may be independently ascertainable and distinct from the code layer and may include a plurality of reference objects that are robust to distortion upon projection. At least one of the code layer and carrier layer may have been pre-shaped by a synthetic point spread function prior to projection. The code layer may be adjusted, at a processing circuit, for distortion based on the reference objects within the portion of the composite code mask.

Abstract: An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground plane of a circuit board.

Abstract: An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.

Abstract: An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground plane of a circuit board.

Abstract: An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.

Abstract: An EMI-shielding riser card for reducing electromagnetic radiation from a computer enclosure is disclosed. The EMI-shielding riser card is a six-layer riser card having a connector adjacent its lower edge, such as a connector for an NLX system board. A cable connection socket is on the riser card a first distance away from the connector, and a plurality of traces in a signal layer of the riser card run between the cable connection socket and the connector. A first ground layer in the riser card is interposed between the signal layer and a first surface of the riser card. A second ground layer in the riser card is interposed between the signal layer and a second surface of the riser card. The first and second ground layers are configured to attach to a ground connection for a system board for which the riser card is adapted.

Abstract: An apparatus for containing electromagnetic interference (EMI). The apparatus includes an enclosure for an EMI producing component. The enclosure has a set of springable tabs extending from a top edge of the enclosure and a set of pins extending from a bottom edge of the enclosure. The pins are placed through a grounding ring and a printed circuit board to align and ground the enclosure. The tabs contact a heatsink disposed over the enclosure.

Abstract: A shielding apparatus for containing electromagnetic energy is disclosed. In one embodiment, a shield includes a plurality of sides, each side having a top and a bottom. A flange may extend from the top of the sides. A plurality of tabs extend from the flanges. The tabs include a first, second, and third portions. The first portion extends directly from the flange. The second portion extends at an angle from the first portion relative to the plane of the first portion and the flange. The longitudinal axis of the second portion is parallel to its associated flange or side. A third portion extends from the second portion, at an angle relative, to the second portion. A heat sink coated with an electrically conductive material may be mounted such that a bottom side of the heat sink is in contact with the plurality of tabs.

Abstract: An apparatus for containing electromagnetic interference (EMI). The apparatus includes an enclosure for an EMI producing component. The enclosure has a set of springable tabs extending from a top edge of the enclosure and a set of pins extending from a bottom edge of the enclosure. The pins are placed through a grounding ring and a printed circuit board to align and ground the enclosure. The tabs contact a heatsink disposed over the enclosure.

Abstract: An EMI-shielding riser card for reducing electromagnetic radiation from a computer enclosure is disclosed. The EMI-shielding riser card is a six-layer riser card having a connector adjacent its lower edge, such as a connector for an NLX system board. A cable connection socket is on the riser card a first distance away from the connector, and a plurality of traces in a signal layer of the riser card run between the cable connection socket and the connector. A first ground layer in the riser card is interposed between the signal layer and a first surface of the riser card. A second ground layer in the riser card is interposed between the signal layer and a second surface of the riser card. The first and second ground layers are configured to attach to a ground connection for a system board for which the riser card is adapted.

Abstract: An integrated circuit package comprising EMI containment features. The EMI containment features include a first EMI containment configuration and a second EMI containment configuration. The second EMI containment configuration is disposed around the first EMI containment configuration. The first and second EMI containment configurations include vias coupled to at least one ground plane of the integrated circuit package.

Abstract: A shielded riser card assembly for reducing electromagnetic radiation from a computer enclosure is disclosed. The riser card assembly comprises a four-layer riser card having a connector adjacent its lower edge, such as a connector for an NLX system board. A cable connection socket is on the riser card a first distance away from the connector, and a plurality of traces on a surface of the riser card run between the cable connection socket and the connector. A sheet of conductive material covers the plurality of traces and is spaced a second distance apart from the surface of the riser card. At least one fastener connected is to the sheet and attached to the riser card. The fastener conductively connects the sheet of conductive material to a ground layer of the riser card. A plurality of non-conductive spacers are disposed between and in contact with both of the sheet and the riser card, for maintaining the sheet a predetermined distance away from the riser card.

Abstract: A method and apparatus for reducing electromagnetic radiation emanating from a computer enclosure are disclosed, for application to computer enclosure enclosing at least one source of electromagnetic radiation of a computer system, where the enclosure includes an unshielded opening in the computer enclosure through which an undesirable amount of electromagnetic radiation from the source is capable of passing to an exterior of the computer enclosure. The apparatus includes a system board mounted to a frame of the computer enclosure, and a riser card connected to the system board within the computer enclosure. The riser card is a PCB having at least one ground layer and a signal layer, and extends transversely from the system board. The riser card divides an interior space of the computer enclosure into two compartments, a source compartment containing the source of electromagnetic radiation, and an unshielded compartment having the unshielded opening in it.