Abstract: Embodiments of the present invention herein generally relate to a system for heat removal from server racks of data centre, wherein the system comprising a back panel, at least a heat exchanger provided within the back panel, at least one exhaust fan, and at least one second layer covering said back panel wherein said second layer comprises of a plurality of perforations to allow air to disperse from said server rack used for storing servers through said back panel.

Abstract: A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, a temperature controlled medium thermally coupled to the thermoelectric device and a temperature feedback sensor. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control to activate the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to activate the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.

Abstract: According to embodiments of the present invention, a bioreactor for growing photoautotrophic organisms is provided. The bioreactor includes a vessel configured to receive the photoautotrophic organisms, the vessel having a longitudinal axis, which a circumferential wall extends around said axis, wherein said circumferential wall is translucent so as to enable light to enter the vessel from the outside for acting on the photoautotrophic organisms, wherein a device for providing an uneven distribution of the light intensity within said vessel along said axis is provided.

Abstract: There is provided an apparatus for heat dissipation and a method for fabricating the apparatus for heat dissipation. The apparatus for heat dissipation is for either single or two phase heat exchange, depending on a construction of the apparatus. A channel of the apparatus is defined by the joined bent first ends of each of a plurality of fins of the apparatus.

Abstract: According to embodiments of the present invention, a bioreactor for growing photoautotrophic organisms is provided. The bioreactor includes a vessel configured to receive the photoautotrophic organisms, the vessel having a longitudinal axis, which a circumferential wall extends around said axis, wherein said circumferential wall is translucent so as to enable light to enter the vessel from the outside for acting on the photoautotrophic organisms, wherein a device for providing an uneven distribution of the light intensity within said vessel along said axis is provided.

Abstract: A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).

Abstract: A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, a temperature controlled medium thermally coupled to the thermoelectric device and a temperature feedback sensor. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control to activate the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to activate the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.

Abstract: A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, and a temperature controlled medium thermally coupled to the thermoelectric device. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control signal to pump heat through the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to pump heat through the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.

Abstract: This disclosure concerns micro-scale heat transfer systems. Some systems relate to electronics cooling. As one example a microscale heat transfer system can comprise a microchannel heat exchanger defining a plurality of flow microchannels fluidicly coupled to each other by a plurality of cross-connect channels. The cross-connect channels can be spaced apart along a streamwise flow direction defined by the flow microchannels. Such a configuration of flow microchannels and cross-connect channels can enable the microchannel heat exchanger to stably vaporize a portion of a working fluid when the microchannel heat exchanger is thermally coupled to a heat source. Microscale heat transfer systems can also comprise a condenser fluidicly coupled to the microchannel heat exchanger and configured to condense the vaporized portion of the working fluid. A pump can circulate the working fluid between the microchannel heat exchanger and the condenser.

Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.

Abstract: A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).

Abstract: An electronic device may include a heat generating component and a surface adjacent the heat generating component. A temperature of the heat generating component may be greater than a temperature of the surface adjacent the heat generating component during operation of the electronic device. A thermoelectric heat pump between the surface and the heat generating component may be configured to pump heat from a cold side of the thermoelectric heat pump adjacent the surface toward the heat generating component. Related methods are also discussed.

Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.

Abstract: A fan integrated thermal management device, such as a heat sink, may include an integrated fan to facilitate air flow through the device. One embodiment of the thermal management device may include a heat-conductive base and a plurality of heat-conductive extensions extending from the base and defining one or more fan blade regions. One or more fans may be mounted relative to the heat-conductive extensions such that at least one fan blade is located in the fan blade region and is configured to rotate through the fan blade region. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.

Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.

Abstract: A piezoelectric fan comprising two or more prongs and a bulk flow portion.

Abstract: A temperature control system may include a thermoelectric device, and a controller electrically coupled to the thermoelectric device. The controller may be configured to apply an AC signal to the thermoelectric device, and to sense an electrical characteristic of the thermoelectric device using the AC signal. The controller may also be configured to generate an electrical control signal to pump heat through the thermoelectric device responsive to sensing the electrical characteristic of the thermoelectric device using the AC signal. Related methods are also discussed.

Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.

Abstract: A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.