Patents by Inventor Seth C. Tai

Seth C. Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular equipment center integrated truss sensors
    Patent number: 9183983
    Abstract: A modular truss assembly for mechanically and electrically mounting system components of a modular equipment center (MEC). A plurality of MECs is spatially distributed throughout the vehicle to service equipment loads. The modular truss assembly provides different voltage levels for powering the system components of the MEC and for powering the equipment loads. In one or more configurations, a MEC incorporate inductive power coupling for powering a line replaceable unit (LRU) in proximity to the modular truss assembly without exposed electrical connections and such that the MEC may forgo power conversion equipment. In one or more configurations, a sensor is embedded in one or more transfer layers of the truss for measuring a power trace embedded in the modular truss assembly.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: November 10, 2015
    Assignee: THE BOEING COMPANY
    Inventors: Mark E. Liffring, Robert D. Holley, Ty A. Larsen, John T. Paterson, Lowell W. Schaffner, Christopher M. Severns, Thomas R. Hasenoehrl, Mark S. Shander, Seth C. Tai, Ronald C. Yabut
  • Modular Equipment Center Integrated Truss Sensors
    Publication number: 20150103458
    Abstract: A modular truss assembly for mechanically and electrically mounting system components of a modular equipment center (MEC). A plurality of MECs is spatially distributed throughout the vehicle to service equipment loads. The modular truss assembly provides different voltage levels for powering the system components of the MEC and for powering the equipment loads. In one or more configurations, a MEC incorporate inductive power coupling for powering a line replaceable unit (LRU) in proximity to the modular truss assembly without exposed electrical connections and such that the MEC may forgo power conversion equipment. In one or more configurations, a sensor is embedded in one or more transfer layers of the truss for measuring a power trace embedded in the modular truss assembly.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 16, 2015
    Applicant: The Boeing Company
    Inventors: Mark E. Liffring, Robert D. Holley, Ty A. Larsen, John T. Paterson, Lowell W. Schaffner, Christopher M. Severns, Thomas R. Hasenoehrl, Mark S. Shander, Seth C. Tai, Ronald C. Yabut