Abstract: A cost-effective packaging system (10) for ultra high density input/output (integrated circuits (14). The packaging system includes a first circuit chip (14) that has a first pattern of contacts (16) distributed across a surface area of the chip (14). The first pattern of contacts (16) represents input/output connections (16). A three-dimensional circuit (18) is disposed spatially parallel with respect to the first circuit chip (14) and organizes the input/output connections (16) into a second pattern of contacts (24, 30) suitable for connection to a second circuit (22). In a specific embodiment, the three-dimensional circuit (18) is a double sided DECAL (18). The double-sided DECAL (18) includes a substrate (18) having a first circuit pattern (28) spatially parallel with a second circuit pattern (30) on or in the substrate (18). The first and second circuit patterns (28 and 30) are interconnected.

Abstract: Laminate or DECAL removal tooling and method for removing an interconnect substrate, such as a thin DECAL-like structure from a surface of a printed wiring board, heat sink, or other rigid substrate or structure. The tooling may be used to remove a thin laminate, such as a polyimide decal, from pattern metallized and pattern unmetallized polyimide, or ceramic metallized substrates, or thermally conductive heat exchangers. A cylindrical thermode is heated and secured with a layer of adhesive to the thin DECAL-like interconnect structure. The thermode has a non slip drive mechanism attached thereto that is coupled to a drive mechanism. The thermode is moved by the drive mechanism to peel the thin laminate from the rigid substrate without damage. This allows a new DECAL-like structure to be applied to the rigid substrate.