Patents by Inventor Seth KNUPP

Seth KNUPP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and Methods for Forming Thermal Interface Material on Substrates
    Publication number: 20260018552
    Abstract: Methods and apparatus for processing a substrate include sputtering a first seed layer having a first thickness on the substrate, the first seed layer comprising a thermal interface material having a tilted crystallographic orientation with respect to the substrate; sputtering a second layer having a second thickness on the first seed layer, the second layer comprising the thermal interface material; and polishing the second layer until a surface roughness of the second layer is suitable for at least one of fusion bonding, thermal compression bonding, or hybrid bonding.
    Type: Application
    Filed: July 9, 2024
    Publication date: January 15, 2026
    Inventors: Keith-Kwong-Hon WONG, Kun LI, Jason APPELL, Seth KNUPP, Joseph SHEPARD, Daniel Konrad Paul TIRE