Abstract: A shelf assembly can comprise a plurality of stanchions, each stanchion having an axis of elongation and comprising a pair of generally parallel legs that define a slot therebetween and respective front edges. A shelf can have an underside and an opposed upper surface that defines a plane. The shelf can be pivotably coupled to the stanchions about an axis about and between a stowed position and a use position. The axis can extend through the plurality of stanchions at a location above the plane when the shelf is in the use position. At least one biasing element can be disposed at least partially within the slot and configured to bias the shelf toward the stowed position.

Abstract: A shelf assembly can comprise a plurality of stanchions, each stanchion having an axis of elongation and comprising a pair of generally parallel legs that define a slot therebetween and respective front edges. A shelf can have an underside and an opposed upper surface that defines a plane. The shelf can be pivotably coupled to the stanchions about an axis about and between a stowed position and a use position. The axis can extend through the plurality of stanchions at a location above the plane when the shelf is in the use position. At least one biasing element can be disposed at least partially within the slot and configured to bias the shelf toward the stowed position.

Abstract: The object of the invention is to provide an automatic module and cassette station detecting and aligning semiconductor wafer/substrate material handling unit with a thermal processing chamber module having an integrated, sturdy, chemical and temperature resistant wafer lift pins and door actuation apparatus. One of the benefits that is derived from this apparatus is the ability to quickly and easily attach various processing modules at any docking position of the semiconductor wafer/substrate material handling unit (hereinafter MHU). The MHU of this apparatus has the additional benefit of a cassette station that automatically aligns and detects a plurality of different size and shape semiconductor wafer/substrate cassettes. The semiconductor wafer/substrate cassettes may also be functionally attached to a module that is docked to the MHU for use.