Patents by Inventor Setsuko Hirakawa

Setsuko Hirakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hardenable epoxy resin composition
    Patent number: 8426504
    Abstract: The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: April 23, 2013
    Assignee: Adeka Corporation
    Inventors: Takahiro Mori, Setsuko Hirakawa, Yoshihiro Fukuda, Seiichi Saito, Yoshinori Takahata, Mitsunori Ide
  • HARDENABLE EPOXY RESIN COMPOSITION
    Publication number: 20100190899
    Abstract: The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.
    Type: Application
    Filed: May 17, 2006
    Publication date: July 29, 2010
    Applicant: ADEKA CORPORATION
    Inventors: Takahiro Mori, Setsuko Hirakawa, Yoshihiro Fukuda, Seiichi Saito, Yoshinori Takahata, Mitsunori Ide