Abstract: Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of ?26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface.

Abstract: Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of ?26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface.

Abstract: This secondary battery negative electrode material constitutes an active material layer formed on a current collector layer of a secondary battery negative electrode and includes a Si particle and a coating material containing Ni and P, formed to cover a surface of the Si particle.

Abstract: There is a highly reliable semiconductor module having a satisfactory bonding strength in the electrical bonded portion. In the semiconductor module 10, a semiconductor chip 11 is mounted on a circuit board 20. In the circuit board 20, on an insulating ceramic substrate 21 is formed a metal circuit plate 22 on which the semiconductor chip 11 is implemented. The semiconductor chip 11 and metal circuit plate 22 are connected with each other by an aluminum bonding wire 23. In the connected portion between the metal circuit plate 22 and bonding wire 23, a coating layer 24 for excellent conjunction therebetween is mounted. The coating layer 24, as shown in an enlarged diagram, is made up of a nickel (Ni) layer 241, a P-distributed palladium (Pd) layer 242, and an Au layer 243 in increasing order. To the P-distributed Pd layer 242 is added P (phosphorous) and, the P concentration on the Ni layer 241 is higher than that on the Au layer side 243.

Abstract: This secondary battery negative electrode material constitutes an active material layer formed on a current collector layer of a secondary battery negative electrode and includes a Si particle and a coating material containing Ni and P, formed to cover a surface of the Si particle.

Abstract: This invention provides a casing for storing MEA, which has satisfactory corrosion resistance to formic acid produced in an electrode reaction of MEA. There is also provided a casing formed of a material having the lowest possible specific gravity that can apply a suitable pushing pressure to MEA and a current collector without increasing the thickness dimension and is suitable for a power supply mounted, for example, in small portable electronic equipment. The casing is a casing for use in a fuel battery in which a hydrogen electrode, an oxygen electrode, and a film-electrode joint product formed of a proton conductive film held between the hydrogen electrode and the oxygen electrode are housed within the casing and, in removing water produced in an oxygen electrode reaction, the above water comes into contact with the casing. The casing for a fuel battery comprises a base material (2a) formed of a magnesium alloy and a film (2b) provided on the base material (2a).

Abstract: There is a highly reliable semiconductor module having a satisfactory bonding strength in the electrical bonded portion. In the semiconductor module 10, a semiconductor chip 11 is mounted on a circuit board 20. In the circuit board 20, on an insulating ceramic substrate 21 is formed a metal circuit plate 22 on which the semiconductor chip 11 is implemented. The semiconductor chip 11 and metal circuit plate 22 are connected with each other by an aluminum bonding wire 23. In the connected portion between the metal circuit plate 22 and bonding wire 23, a coating layer 24 for excellent conjunction therebetween is mounted. The coating layer 24, as shown in an enlarged diagram, is made up of a nickel (Ni) layer 241, a P-distributed palladium (Pd) layer 242, and an Au layer 243 in increasing order. To the P-distributed Pd layer 242 is added P (phosphorous) and, the P concentration on the Ni layer 241 is higher than that on the Au layer side 243.

Abstract: This invention provides a casing for storing MEA, which has satisfactory corrosion resistance to formic acid produced in an electrode reaction of MEA. There is also provided a casing formed of a material having the lowest possible specific gravity that can apply a suitable pushing pressure to MEA and a current collector without increasing the thickness dimension and is suitable for a power supply mounted, for example, in small portable electronic equipment. The casing is a casing for use in a fuel battery in which a hydrogen electrode, an oxygen electrode, and a film-electrode joint product formed of a proton conductive film held between the hydrogen electrode and the oxygen electrode are housed within the casing and, in removing water produced in an oxygen electrode reaction, the above water comes into contact with the casing. The casing for a fuel battery comprises a base material (2a) formed of a magnesium alloy and a film (2b) provided on the base material (2a).