Patents by Inventor Setsuo Andou

Setsuo Andou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9514887
    Abstract: An object of the present invention is to provide an aluminum foil that can make a positive electrode current collector thinner for size reduction and higher energy density of electrical storage devices, be produced easily and has a low surface resistance. An aluminum foil of the present invention as a means for achieving the object is characterized in that carbonaceous particles are dispersed and supported therein. The aluminum foil with carbonaceous particles dispersed and supported therein of the present invention can be produced by electrolysis.
    Type: Grant
    Filed: November 11, 2010
    Date of Patent: December 6, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Atsushi Okamoto, Hiroyuki Hoshi, Setsuo Andou
  • Patent number: 9267216
    Abstract: A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: February 23, 2016
    Assignee: HITACHI METALS LTD.
    Inventors: Atsushi Okamoto, Hiroyuki Hoshi, Setsuo Andou
  • Patent number: 9219279
    Abstract: An object of the present invention is to provide a method for producing a high-ductility, high-purity aluminum foil at a high film formation rate by electrolysis using a plating solution having a low chlorine concentration. A method for producing an aluminum foil of the present invention as a means for achieving the object is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution at least containing (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by a general formula: R1R2R3R4N.X (wherein R1 to R4 independently represent an alkyl group and X represents a counteranion for the quaternary ammonium cation), and then the film is removed from the substrate.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: December 22, 2015
    Assignee: HITACHI METALS, LTD.
    Inventors: Atsushi Okamoto, Hiroyuki Hoshi, Setsuo Andou
  • Patent number: 8586196
    Abstract: A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. The hardness is increased by containing oxygen, carbon, sulfur, and a halogen element as impurities. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: November 19, 2013
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hiroyuki Hoshi, Atsushi Okamoto, Setsuo Andou
  • Publication number: 20130224589
    Abstract: A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.
    Type: Application
    Filed: November 10, 2011
    Publication date: August 29, 2013
    Applicant: HITACHI METALS, LTD.
    Inventors: Atsushi Okamoto, Hiroyuki Hoshi, Setsuo Andou
  • Publication number: 20120298514
    Abstract: A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. The hardness is increased by containing oxygen, carbon, sulfur, and a halogen element as impurities. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
    Type: Application
    Filed: August 6, 2012
    Publication date: November 29, 2012
    Applicant: HITACHI METALS, LTD.
    Inventors: Hiroyuki HOSHI, Atsushi OKAMOTO, Setsuo ANDOU
  • Publication number: 20120251879
    Abstract: An object of the present invention is to provide an aluminum foil that can make a positive electrode current collector thinner for size reduction and higher energy density of electrical storage devices, be produced easily and has a low surface resistance. An aluminum foil of the present invention as a means for achieving the object is characterized in that carbonaceous particles are dispersed and supported therein. The aluminum foil with carbonaceous particles dispersed and supported therein of the present invention can be produced by electrolysis.
    Type: Application
    Filed: November 11, 2010
    Publication date: October 4, 2012
    Applicant: HITACHI METALS, LTD.
    Inventors: Atsushi Okamoto, Hiroyuki Hoshi, Setsuo Andou
  • Patent number: 8262893
    Abstract: A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. The hardness is increased by containing oxygen, carbon, sulfur, and a halogen element as impurities. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: September 11, 2012
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hiroyuki Hoshi, Atsushi Okamoto, Setsuo Andou
  • Publication number: 20120088153
    Abstract: An object of the present invention is to provide a method for producing a high-ductility, high-purity aluminum foil at a high film formation rate by electrolysis using a plating solution having a low chlorine concentration. A method for producing an aluminum foil of the present invention as a means for achieving the object is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution at least containing (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by a general formula: R1R2R3R4N.X (wherein R1 to R4 independently represent an alkyl group and X represents a counteranion for the quaternary ammonium cation), and then the film is removed from the substrate.
    Type: Application
    Filed: June 28, 2010
    Publication date: April 12, 2012
    Applicant: HITACHI METALS, LTD.
    Inventors: Atsushi Okamoto, Hiroyuki Hoshi, Setsuo Andou
  • Publication number: 20090301886
    Abstract: A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. Here, by containing oxygen, carbon, sulfur, and a halogen element as impurities, the hardness becomes higher. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
    Type: Application
    Filed: June 25, 2007
    Publication date: December 10, 2009
    Applicant: Hitachi Metals, Ltd.
    Inventors: Hiroyuki Hoshi, Atsushi Okamoto, Setsuo Andou