Patents by Inventor Setsuo Itami

Setsuo Itami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10793717
    Abstract: Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: October 6, 2020
    Assignee: JNC CORPORATION
    Inventors: Atsushi Murotani, Takayuki Hirota, Katsuyuki Sugihara, Yoshihiro Deyama, Shinta Morokoshi, Setsuo Itami, Toshiyuki Takahashi
  • Publication number: 20180009983
    Abstract: Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.
    Type: Application
    Filed: January 20, 2016
    Publication date: January 11, 2018
    Inventors: Atsushi MUROTANI, Takayuki HIROTA, Katsuyuki SUGIHARA, Yoshihiro DEYAMA, Shinta MOROKOSHI, Setsuo ITAMI, Toshiyuki TAKAHASHI
  • Publication number: 20130251983
    Abstract: To provide a material capable of obtaining a transparent conductive film having an excellent conductivity, Optical transmission, Environmental reliability, suitability for process, adhesion and hardness in a single application process, and to provide a transparent conductive film using the same and a device element using the same. A coating forming composition containing at least one kind selected from the group of metal nanowires and metal nanotubes as a first component, a polymer compound having a hydroxyl group as a second component, a compound having a group 13 element or a transition metal element as a third component, and further a solvent is prepared to obtain a transparent conductive film by the coating.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 26, 2013
    Applicant: JNC CORPORATION
    Inventors: YASUHIRO KONDO, MOTOKI YANAI, SETSUO ITAMI
  • Patent number: 8273805
    Abstract: An ink-jet ink is provided. The ink-jet ink includes a compound of formula (1) to form a cured film with high-flame retardancy.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: September 25, 2012
    Assignee: JNC Corporation
    Inventors: Hiroyuki Satou, Setsuo Itami, Yosihiro Deyama
  • Publication number: 20120183768
    Abstract: A subject is to provide a material capable of obtaining a transparent conductive film having an excellent conductivity, optical transparency, environmental resistance, process resistance and close contact in a single application process, and to provide a transparent conductive film and a device element using the same. The means is to prepare a coating forming composition containing at least one kind of materials selected from the group of metal nanowires and metal nanotubes as a first component, polysaccharides and a derivative thereof as a second component, a thermosetting resin compound as a third component, and water as a fourth component to obtain a transparent conductive film by using the coating.
    Type: Application
    Filed: January 11, 2012
    Publication date: July 19, 2012
    Applicant: JNC CORPORATION
    Inventors: Yasuhiro Kondo, Keiichi Nakamoto, Setsuo Itami, Motoki Yanai
  • Patent number: 7926930
    Abstract: The invention relates to a method for manufacturing an inkjet ink including a polyamic acid (A), including a step of at least reacting one or more compounds selected from the group of a monoamine (a3) and a compound having one acid anhydride group (a4) with a compound having two or more acid anhydride groups (a1) and a diamine (a2).
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: April 19, 2011
    Assignee: Chisso Corporation
    Inventors: Hiroyuki Satou, Setsuo Itami, Takayuki Hattori
  • Patent number: 7745506
    Abstract: A UV-curable ink-jet ink is provided, which has a high sensitivity and allows soft and highly fine patterns to be formed. The UV-curable ink-jet ink includes a mono-functional polymerizable monomer (A) having a hydroxyl group, a di(meth)acrylate ester (B) and a photo-polymerization initiator (C).
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: June 29, 2010
    Assignee: Chisso Corporation
    Inventors: Hiroyuki Satou, Setsuo Itami, Fumitaka Ooizumi, Toshiyuki Takahashi
  • Publication number: 20090056993
    Abstract: The invention provides a method for forming a cured film, comprising discharging an ink-jet ink, which comprises predetermined compounds, whose viscosity at 25° C. is approximately 150 to approximately 3,000 mPa·s, from an ink-jet head at a discharging temperature of approximately 80 to approximately 150° C., which has a low degree of spread of an ink-jet ink after landing, and which is able to form a highly-fine pattern.
    Type: Application
    Filed: August 27, 2008
    Publication date: March 5, 2009
    Applicant: CHISSO CORPORATION
    Inventors: Hiroyuki Satou, Setsuo Itami
  • Publication number: 20080255297
    Abstract: An ink-jet ink suitable for forming a cured film with a balance of flame resistance, adhesion, chemical resistance, heat resistance, and softness, and a cured film with an excellent balance of the above properties are provided.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 16, 2008
    Applicant: CHISSO CORPORATION
    Inventors: Setsuo ITAMI, Tomohiro ETO, Hiroyuki SATOU
  • Publication number: 20080182086
    Abstract: An ink-jet ink is provided. The ink-jet ink includes a compound of formula (1) to form a cured film with high-flame retardancy.
    Type: Application
    Filed: January 29, 2008
    Publication date: July 31, 2008
    Applicant: CHISSO CORPORATION
    Inventors: HIROYUKI SATOU, SETSUO ITAMI, YOSIHIRO DEYAMA
  • Publication number: 20080152845
    Abstract: The invention provides a cured film, which is particularly excellent in flatness and heat resistance and is also excellent in solvent resistance, chemical resistance such as acid resistance, alkali resistance and the like, water resistance, ability to adhere to a substrate such as glass and the like, transparency, scratch resistance, coatability and light resistance, and a resin composition providing the cured film.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 26, 2008
    Inventor: Setsuo Itami
  • Publication number: 20080085361
    Abstract: The invention relates to a method for manufacturing an inkjet ink including a polyamic acid (A), including a step of at least reacting one or more compounds selected from the group of a monoamine (a3) and a compound having one acid anhydride group (a4) with a compound having two or more acid anhydride groups (a1) and a diamine (a2).
    Type: Application
    Filed: August 30, 2007
    Publication date: April 10, 2008
    Inventors: Hiroyuki Satou, Setsuo Itami, Takayuki Hattori
  • Publication number: 20080038570
    Abstract: A UV-curable ink-jet ink is provided, which has a high sensitivity and allows soft and highly fine patterns to be formed. The UV-curable ink-jet ink includes a mono-functional polymerizable monomer (A) having a hydroxyl group, a di(meth)acrylate ester (B) and a photo-polymerization initiator (C).
    Type: Application
    Filed: July 11, 2007
    Publication date: February 14, 2008
    Applicant: CHISSO CORPORATION
    Inventors: HIROYUKI SATOU, SETSUO ITAMI, FUMITAKA OOIZUMI, TOSHIYUKI TAKAHASHI
  • Patent number: 5300627
    Abstract: A silicon-modified, adhesive polyimide film composed mainly of the repetition units of the formula (I) and a process for producing a polyimide film composite product using the above film are provided, the formula (I) being ##STR1## the above process for producing a polyimide film composite product comprising subjecting the above-silicon-modified polyimide film to contact-bonding on heating to a material to be adhered, at an ultimate curing temperature of 130.degree.-230.degree. C.The above polyimide film is highly adhesive and heat-resistant in spite of heating at a relatively low temperature.
    Type: Grant
    Filed: September 15, 1992
    Date of Patent: April 5, 1994
    Assignee: Chisso Corporation
    Inventors: Kouichi Kunimune, Yoshihiro Soeda, Setsuo Itami, Kazutsune Kikuta