Patents by Inventor Setsuo Sekine

Setsuo Sekine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire with coating for ultrasonic bonding
    Patent number: 4963435
    Abstract: A wire with a coated layer for bonding to a joint body by ultrasonic vibration, the coated layer of said wire comprising urethane resin having formulated therein a brominated epoxy resin.
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: October 16, 1990
    Assignees: Hitachi, Ltd., Hitachi Computer Peripherals Co., Ltd., Hitachi Cable, Ltd.
    Inventors: Shigeo Hara, Setsuo Sekine, Toshio Suzuki, Minoru Taguchi, Akio Mitsuoka, Yoshiyuki Tetsu