Patents by Inventor Setsuo Toyoshima

Setsuo Toyoshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050003174
    Abstract: A wallpaper having a laminated structure comprising a mat finishing film layer formed of a thermoplastic resin film or a front nonwoven fabric layer with printability, stacked thereon a water-repellent pulp fibrous nonwoven fabric layer having a bulk density of 0.05 to 0.3 g/cm3, stacked thereon a polyolefin-laminated backing paper layer, wherein the adhesion of each layer is accomplished by a hot-melt bonding, characterized in that said mat finishing film layer or said front nonwoven fabric layer has a concave-convex pattern formed by applying heat-embossing treatment to said mat finishing film layer side or said front nonwoven fabric layer side is provided.
    Type: Application
    Filed: June 10, 2004
    Publication date: January 6, 2005
    Inventors: Hideki Ikeda, Setsuo Toyoshima
  • Patent number: 6566288
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: May 20, 2003
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Patent number: 6426310
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: July 30, 2002
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Publication number: 20010006868
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Application
    Filed: February 6, 2001
    Publication date: July 5, 2001
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno