Patents by Inventor Setsuo Yamamoto

Setsuo Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11315822
    Abstract: A porous chuck table for holding a plate-like workpiece under suction includes a porous plate having a porous structure, the porous plate having a holding surface for holding the workpiece under suction thereon, and a frame surrounding the porous plate and having a face side lying flush with the holding surface. The porous plate is at least made of spherical glass particles, adjacent ones of the glass particles are partly joined together, and interstices between adjacent ones of the partly joined glass particles function as pores through which a fluid can flow.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 26, 2022
    Assignee: DISCO CORPORATION
    Inventor: Setsuo Yamamoto
  • Patent number: 11101162
    Abstract: A chuck table includes a main part having a holding surface for holding thereon a workpiece through a dicing tape, and a frame holder disposed around the main part for holding the annular frame. The main part has a flat surface that functions as the holding surface, an outer circumferential suction groove defined in a region of the holding surface that underlies an annular region of the adhesive tape between the workpiece and the frame of the frame unit, for holding the annular region of the adhesive tape under suction, and a suction channel held in fluid communication with the outer circumferential suction groove and a suction source. The frame holder pulls down the frame to a position lower than the holding surface to hold the dicing tape in close contact with the holding surface.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: August 24, 2021
    Assignee: DISCO CORPORATION
    Inventors: Setsuo Yamamoto, Kazuma Sekiya
  • Publication number: 20210074575
    Abstract: A processing apparatus includes a chuck table for holding a plate-shaped workpiece under suction on a holding surface thereof, a processing unit for processing the workpiece held on the holding surface of the chuck table, and a moving unit for moving a support base supporting the chuck table thereon in a processing-feed direction. The chuck table is formed from a porous material having pores, and has the holding surface and a mountable assembly positioned opposite the holding surface and mountable on an upper surface of the support base. Fluid passages defined in the chuck table for allowing a negative pressure transmitted from the support base to act on the holding surface are provided only by the pores in the porous material.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 11, 2021
    Inventors: Setsuo Yamamoto, Nobuyuki Goto
  • Publication number: 20200348237
    Abstract: An elongated ferromagnetic anodic electrode is fixed to a tightly closable pipe shape vacuum casing so as to extend within the casing as a cantilever and magnetic field applying module is disposed so as to concentrate magnetic field at a tip side position of the ferromagnetic anodic electrode in an area of discharge optical emission when a high voltage is applied between the anodic electrode and the vacuum casing as a cathode electrode. In addition, a vacuum casing can be formed with a ferromagnetic and soft magnetic material for magnetic flux to be permeable well, or a tip side alone of an anodic electrode rather than the anodic electrode itself can be formed with a ferromagnetic material, or a ferromagnetic member can be disposed at a near position of an anodic electrode, so as to concentrate magnetic field in a vicinity of a tip of an anodic electrode.
    Type: Application
    Filed: October 23, 2018
    Publication date: November 5, 2020
    Applicants: Marunaka Co., Ltd., Sanko Ematec Co., Ltd., Yamaguchi University
    Inventors: Mitsugu NAKAGAWA, Kazumi ENOMOTO, Setsuo YAMAMOTO, Hiroki KURISU
  • Patent number: 10532411
    Abstract: A chuck table for holding a plate-shaped workpiece under suction includes a suction plate made of porous ceramics and having a plurality of open pores, and a frame covering a side surface and a reverse side, except an attractive suction surface, of the suction plate and having a plurality of suction grooves defined in an upper surface thereof and a fluid communication passage defined therein that holds the suction grooves in fluid communication with a suction source, the frame supporting the suction plate thereon. The suction plate has a porosity in the range from 60% to 70% by volume, and the open pores have diameters in the range from 10 ?m to 25 ?m.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: January 14, 2020
    Assignee: DISCO CORPORATION
    Inventor: Setsuo Yamamoto
  • Publication number: 20200013664
    Abstract: A porous chuck table for holding a plate-like workpiece under suction includes a porous plate having a porous structure, the porous plate having a holding surface for holding the workpiece under suction thereon, and a frame surrounding the porous plate and having a face side lying flush with the holding surface. The porous plate is at least made of spherical glass particles, adjacent ones of the glass particles are partly joined together, and interstices between adjacent ones of the partly joined glass particles function as pores through which a fluid can flow.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 9, 2020
    Inventor: Setsuo YAMAMOTO
  • Publication number: 20190273010
    Abstract: A chuck table includes a main part having a holding surface for holding thereon a workpiece through a dicing tape, and a frame holder disposed around the main part for holding the annular frame. The main part has a flat surface that functions as the holding surface, an outer circumferential suction groove defined in a region of the holding surface that underlies an annular region of the adhesive tape between the workpiece and the frame of the frame unit, for holding the annular region of the adhesive tape under suction, and a suction channel held in fluid communication with the outer circumferential suction groove and a suction source. The frame holder pulls down the frame to a position lower than the holding surface to hold the dicing tape in close contact with the holding surface.
    Type: Application
    Filed: March 5, 2019
    Publication date: September 5, 2019
    Inventors: Setsuo YAMAMOTO, Kazuma SEKIYA
  • Publication number: 20190001433
    Abstract: A laser processing apparatus includes: a chuck table for holding a single-crystal SiC ingot on a holding surface thereof; a laser beam applying unit for applying a laser beam to the single-crystal SiC ingot held on the holding surface of the chuck table; and a camera unit configured to capture an image of the single-crystal SiC ingot held on the holding surface of the chuck table. The chuck table includes a porous material making up the holding surface and a glass frame made of a non-porous material and having a recess defined therein and receiving the porous material fitted therein, and a negative pressure transfer path for transferring a negative pressure to the porous material fitted in the recess.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 3, 2019
    Inventor: Setsuo Yamamoto
  • Publication number: 20180065187
    Abstract: A chuck table for holding a plate-shaped workpiece under suction includes a suction plate made of porous ceramics and having a plurality of open pores, and a frame covering a side surface and a reverse side, except an attractive suction surface, of the suction plate and having a plurality of suction grooves defined in an upper surface thereof and a fluid communication passage defined therein that holds the suction grooves in fluid communication with a suction source, the frame supporting the suction plate thereon. The suction plate has a porosity in the range from 60% to 70% by volume, and the open pores have diameters in the range from 10 ?m to 25 ?m.
    Type: Application
    Filed: August 17, 2017
    Publication date: March 8, 2018
    Inventor: Setsuo Yamamoto
  • Publication number: 20160260299
    Abstract: The image recognition device includes an imaging means for generating an image of a subject, a local area storage means for storing information relating to a local area set in an imaging screen of the imaging means, and an image data processing means for performing exposure control of the imaging means and image recognition processing, based on the image within the local area specified by the information stored in the local area storage means, of the image generated by the imaging means.
    Type: Application
    Filed: December 18, 2013
    Publication date: September 8, 2016
    Applicant: NEC Corporation
    Inventor: Setsuo YAMAMOTO
  • Patent number: 9274021
    Abstract: Provided are a leakage inspection apparatus and a leakage inspection method for inspecting the flow rate of leakage from a tested body disposed in a tested-body chamber 21. The leakage inspection apparatus includes liquid supplying and pressurizing means 11 for supplying a probe liquid to the inside of the tested-body chamber 21 and pressurizing the probe liquid to a high pressure 0.1 MPa or more, vacuum evacuation means 22-b, 23-b and a quadrupole mass spectrometer 34. The tested body 21 is evacuated, the probe liquid is supplied to the inside of the tested body and pressurized to 0.1 MPa or more and the concentration of a probe medium leaked from the tested body and evaporated in a vacuum is measured by the quadrupole mass spectrometer 34, thereby measuring the flow rate of leakage from the tested body. This makes it possible to determine the flow rate of leakage using a liquid as a probe medium and simultaneously possible to perform a pressure tightness inspection at an atmospheric pressure of 0.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: March 1, 2016
    Assignees: YAMAGUCHI UNIVERSITY, MARUNAKA CO., LTD.
    Inventors: Setsuo Yamamoto, Hiroki Kurisu, Naoki Takada, Mitsugu Nakagawa, Katsushi Tsuge, Yukihiro Ishikawa
  • Publication number: 20130199274
    Abstract: Provided are a leakage inspection apparatus and a leakage inspection method for inspecting the flow rate of leakage from a tested body disposed in a tested-body chamber 21. The leakage inspection apparatus includes liquid supplying and pressurizing means 11 for supplying a probe liquid to the inside of the tested-body chamber 21 and pressurizing the probe liquid to a high pressure 0.1 MPa or more, vacuum evacuation means 22-b, 23-b and a quadrupole mass spectrometer 34. The tested body 21 is evacuated, the probe liquid is supplied to the inside of the tested body and pressurized to 0.1 MPa or more and the concentration of a probe medium leaked from the tested body and evaporated in a vacuum is measured by the quadrupole mass spectrometer 34, thereby measuring the flow rate of leakage from the tested body. This makes it possible to determine the flow rate of leakage using a liquid as a probe medium and simultaneously possible to perform a pressure tightness inspection at an atmospheric pressure of 0.
    Type: Application
    Filed: July 1, 2011
    Publication date: August 8, 2013
    Applicants: MARUNAKA CO., LTD., YAMAGUCHI UNIVERSITY
    Inventors: Setsuo Yamamoto, Hiroki Kurisu, Naoki Takada, Mitsugu Nakagawa, Katsushi Tsuge, Yukihiro Ishikawa
  • Patent number: 8025556
    Abstract: A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.
    Type: Grant
    Filed: January 7, 2009
    Date of Patent: September 27, 2011
    Assignee: Disco Corporation
    Inventors: Keiichi Kajiyama, Takatoshi Masuda, Shinya Watanabe, Setsuo Yamamoto
  • Patent number: 7736215
    Abstract: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: June 15, 2010
    Assignee: Disco Corporation
    Inventors: Sinnosuke Sekiya, Setsuo Yamamoto, Yutaka Koma, Masashi Aoki
  • Patent number: 7731567
    Abstract: In a semiconductor wafer processing method of forming a semiconductor wafer having a desired thickness by grinding a rear surface of the semiconductor wafer having a plurality of devices formed on a front surface thereof, the rear surface of the semiconductor wafer is ground so that the semiconductor wafer has a thickness of 10 ?m to 100 ?m, and a strain layer having a thickness of 0.05 ?m to 0.1 ?m is left on the rear surface of the semiconductor wafer by the grinding. The strain layer is left to provide the gettering effect, preventing a harmful influence exerted on the quality of the semiconductor devices. Degradation in transverse rupture strength can be prevented by the grinding.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: June 8, 2010
    Assignee: Disco Corporation
    Inventors: Shinnosuke Sekiya, Setsuo Yamamoto, Naoya Sukegawa, Naruto Fuwa
  • Patent number: 7713107
    Abstract: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: May 11, 2010
    Assignee: Disco Corporation
    Inventors: Sinnosuke Sekiya, Setsuo Yamamoto
  • Patent number: 7677955
    Abstract: A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa or more. The grinding wheel is composed of a frame and an abrasive member fixed to the free end of the frame. The abrasive member is produced by fixing diamond abrasive grains having a grain size of less than or equal to 1 ?m with a vitrified bond. A protective member is attached to the front side of the wafer and the wafer is held on a chuck table in the condition where the protective member is in contact with the chuck table. The grinding wheel is rotated as rotating the chuck table to thereby grind the back side of the wafer by means of the abrasive member so that the average surface roughness of the back side of the wafer becomes less than or equal to 0.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: March 16, 2010
    Assignee: Disco Corporation
    Inventors: Keiichi Kajiyama, Takatoshi Masuda, Shinya Watanabe, Shigehiko Aoki, Hirotoshi Hoshikawa, Yoshikazu Kobayashi, Seiji Harada, Setsuo Yamamoto
  • Publication number: 20090186562
    Abstract: A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.
    Type: Application
    Filed: January 7, 2009
    Publication date: July 23, 2009
    Applicant: DISCO CORPORATION
    Inventors: Keiichi Kajiyama, Takatoshi Masuda, Shinya Watanabe, Setsuo Yamamoto
  • Publication number: 20090104858
    Abstract: In order not to transmit an impact when grinding is started, or micro-vibrations of a grinding wheel during grinding to a wafer, a grinding apparatus at least includes: a chuck table that holds a wafer; a grinding unit having a grinding wheel configured to include a grinding wheel part that is fixed to a wheel base and grinds a wafer held on the chuck table and having a wheel mount that supports the wheel base; and a grinding unit feeding unit that brings the grinding unit dose to and away from the chuck table, wherein a vibration damping rubber having a rebound resilience of 2% to 4% standardized by ISO 4662 is provided between the wheel base and the wheel mount, whereby an impact when grinding is started, or micro-vibrations of a grinding wheel during grinding are absorbed.
    Type: Application
    Filed: October 8, 2008
    Publication date: April 23, 2009
    Inventor: Setsuo YAMAMOTO
  • Publication number: 20090098808
    Abstract: A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa or more. The grinding wheel is composed of a frame and an abrasive member fixed to the free end of the frame. The abrasive member is produced by fixing diamond abrasive grains having a grain size of less than or equal to 1 ?m with a vitrified bond. A protective member is attached to the front side of the wafer and the wafer is held on a chuck table in the condition where the protective member is in contact with the chuck table. The grinding wheel is rotated as rotating the chuck table to thereby grind the back side of the wafer by means of the abrasive member so that the average surface roughness of the back side of the wafer becomes less than or equal to 0.
    Type: Application
    Filed: October 1, 2008
    Publication date: April 16, 2009
    Applicant: DISCO CORPORATION
    Inventors: Keiichi Kajiyama, Takatoshi Masuda, Shinya Watanabe, Shigehiko Aoki, Hirotoshi Hoshikawa, Yoshikazu Kobayashi, Seiji Harada, Setsuo Yamamoto