Patents by Inventor Setsusei REI

Setsusei REI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING SMALL-DIAMETER WAFER
    Publication number: 20190148132
    Abstract: A method of manufacturing a small-diameter wafer from a wafer having one face and the other face, the one face being mirror-polished, is provided. The method includes a protective member covering step of covering the one face of the wafer with a first protective member and the other face of the wafer with a second protective member, a cut-out step of cutting out a plurality of small-diameter wafers from the wafer covered with the first protective member and the second protective member, a chamfering step of chamfering an outer periphery portion of each of the plurality of small-diameter wafers, and a protective member removing step of removing the first protective member and the second protective member from each of the plurality of small-diameter wafers.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Inventors: Hideji HORITA, Sakae MATSUZAKI, Noriko ITO, Norihisa ARIFUKU, Setsusei REI, Akihito KAWAI, Mai OGASAWARA